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MAX1183ECM+D
Maxim Integrated Products
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$10.4698 | Yes | Yes | Transferred | 3 V | 1 V | 1 | 0.166 % | 10 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HTFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | 7 X 7 MM, 1.0 MM HEIGHT, ROHS COMPLIANT, MS-026ABA-HD, TQFP-48 | 48 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX1183ECM+TD
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | 1 V | 1 | 0.166 % | 10 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HTFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | 48-TQFP_EP-7X7X1.0 | 48 | 48-TQFP_EP-7X7X1.0 | 2001-11-27 | |||||||||
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MAX1183ECM/GG8
Analog Devices Inc
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Check for Price | Active | 3 V | 1 V | 2 | 0.166 % | 10 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | N/A | 48 | N/A | 2001-11-27 | ||||||||||||||||
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MAX1183ECM
Maxim Integrated Products
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Check for Price | No | Obsolete | 3 V | 1 V | 1 | 0.166 % | 10 | 40 MHz | 25 ns | YES | ADC, FLASH METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HTFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | 7 X 7 MM, 1.0 MM HEIGHT, MS-026ABAHD, TQFP-48 | 48 | not_compliant | 8542.39.00.01 | ||||||||
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MAX1183ECM
Rochester Electronics LLC
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Check for Price | No | No | Active | 3 V | 1 V | 1 | 0.166 % | 10 | 40 MHz | 25 ns | YES | ADC, FLASH METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | e0 | 3 | 85 °C | -40 °C | 240 | 20 | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | ROCHESTER ELECTRONICS LLC | QFP | 7 X 7 MM, 1.0 MM HEIGHT, MS-026ABAHD, TQFP-48 | 48 | unknown | ||||||||
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MAX1183ECM/GH9-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | 1 V | 2 | 0.166 % | 10 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | HTFQFP, | compliant | 8542.39.00.01 | ||||||||||||||
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MAX1183ECM+TD
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | 1 V | 1 | 0.166 % | 10 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HTFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | HTFQFP, TQFP48,.35SQ | 48 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX1183ECM-T
Maxim Integrated Products
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Check for Price | No | Obsolete | 3 V | 1 V | 1 | 0.166 % | 10 | 40 MHz | 25 ns | YES | ADC, FLASH METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | HTFQFP, | 48 | compliant | 8542.39.00.01 | |||||||||
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MAX1183ECM/GH9
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | 1 V | 2 | 0.166 % | 10 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL | S-PQFP-G48 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | HTFQFP, | compliant | EAR99 | 8542.39.00.01 | |||||||||||||
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MAX1183ECM+
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | 1 V | 1 | 0.166 % | 10 | 40 MHz | 25 ns | YES | ADC, FLASH METHOD | -1 V | 2 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HTFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | HTFQFP, TQFP48,.35SQ | 48 | compliant | 8542.39.00.01 |