Findchips: Parametric Search Results for M36DR432A

Parametric results for: M36DR432A under Other Memory ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		M36DR432A120ZA6 STMicroelectronics
		M36DR432A100ZA6 STMicroelectronics
		M36DR432A100ZA6C STMicroelectronics
		M36DR432AD12ZA6T STMicroelectronics
		M36DR432A120ZA6T STMicroelectronics
		M36DR432AD10ZA6T STMicroelectronics
		M36DR432A100ZA6T Numonyx Memory Solutions
		M36DR432A120ZA6C Numonyx Memory Solutions
		M36DR432A120ZA6 Numonyx Memory Solutions
		M36DR432AD85ZA6 STMicroelectronics

			Most Relevant					Technical													Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Mixed Memory Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

33.5544 Mbit

2MX16

120 ns

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

40 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

100 ns

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

40 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

100 ns

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

40 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

120 ns

MEMORY CIRCUIT

SRAM IS ORGANIZED AS 256K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

10 µA

26 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

120 ns

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

40 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

100 ns

MEMORY CIRCUIT

SRAM IS ORGANIZED AS 256K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

10 µA

26 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

2000000

2.0972 M

ASYNCHRONOUS

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

LFBGA,

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

2000000

2.0972 M

ASYNCHRONOUS

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

2000000

2.0972 M

ASYNCHRONOUS

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

LFBGA,

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

2 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANIZED AS 256K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

10 µA

26 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

1 2 Next

Compare

M36DR432A120ZA6

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

120 ns

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

40 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36DR432A100ZA6

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

100 ns

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

40 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36DR432A100ZA6C

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

100 ns

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

40 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36DR432AD12ZA6T

STMicroelectronics

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

120 ns

MEMORY CIRCUIT

SRAM IS ORGANIZED AS 256K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

10 µA

26 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36DR432A120ZA6T

STMicroelectronics

Check for Price

Transferred

33.5544 Mbit

2MX16

120 ns

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

40 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36DR432AD10ZA6T

STMicroelectronics

Check for Price

Obsolete

33.5544 Mbit

2MX16

1.8 V

100 ns

MEMORY CIRCUIT

SRAM IS ORGANIZED AS 256K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

10 µA

26 µA

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36DR432A100ZA6T

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

2000000

2.0972 M

ASYNCHRONOUS

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

LFBGA,

not_compliant

EAR99

8542.32.00.71

M36DR432A120ZA6C

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

2000000

2.0972 M

ASYNCHRONOUS

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

M36DR432A120ZA6

Numonyx Memory Solutions

Check for Price

Obsolete

33.5544 Mbit

2MX16

MEMORY CIRCUIT

THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM

2000000

2.0972 M

ASYNCHRONOUS

2.2 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

NUMONYX

BGA

LFBGA,

not_compliant

EAR99

8542.32.00.71

M36DR432AD85ZA6

STMicroelectronics

Check for Price

Obsolete

33.5544 Mbit

2MX16

2 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANIZED AS 256K X 16

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

10 µA

26 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

R-PBGA-B66

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

12 mm

8 mm

STMICROELECTRONICS

BGA

12 X 8 MM, 0.80 MM PITCH, STACK, LFBGA-66

not_compliant

EAR99

8542.32.00.71

1 2 Next