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M2S090T-1FCS325
Microchip Technology Inc
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$229.1698 | No | Active | 1.2 V | 180 | 180 | 86184 | FPGA SOC | RECTANGULAR | 1.26 V | 1.14 V | R-PBGA-B325 | 85 °C | 240 | 30 | 325 | PLASTIC/EPOXY | TFBGA | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 500 µm | BOTTOM | 11 mm | 13.5 mm | 1.16 mm | MICROCHIP TECHNOLOGY INC | FBGA-325 | not_compliant | 8542.31.00.01 | ||||||||
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M2S090T-1FCS325I
Microchip Technology Inc
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$254.6283 | No | Active | 1.2 V | 180 | 180 | 86184 | FPGA SOC | RECTANGULAR | 1.26 V | 1.14 V | R-PBGA-B325 | 100 °C | -40 °C | 240 | 30 | 325 | PLASTIC/EPOXY | TFBGA | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 500 µm | BOTTOM | 11 mm | 13.5 mm | 1.16 mm | MICROCHIP TECHNOLOGY INC | FBGA-325 | not_compliant | 8542.31.00.01 | |||||||
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M2S090T-1FCS325
Microsemi Corporation
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Check for Price | No | Transferred | 1.2 V | 180 | 180 | 86316 | FIELD PROGRAMMABLE GATE ARRAY | RECTANGULAR | CMOS | LG-MIN, WD-MIN | 1.26 V | 1.14 V | R-PBGA-B325 | Not Qualified | e0 | 85 °C | 240 | 30 | 325 | PLASTIC/EPOXY | TFBGA | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 500 µm | BOTTOM | 11 mm | 13.5 mm | 1.16 mm | MICROSEMI CORP | TFBGA, BGA325,21X21,20 | not_compliant | 8542.39.00.01 | Microsemi Corporation | |||
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M2S090T-1FCS325I
Microsemi Corporation
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Check for Price | No | Transferred | 1.2 V | 180 | 180 | 86316 | FIELD PROGRAMMABLE GATE ARRAY | RECTANGULAR | CMOS | LG-MIN, WD-MIN | 1.26 V | 1.14 V | R-PBGA-B325 | Not Qualified | e0 | 100 °C | -40 °C | 240 | 30 | 325 | PLASTIC/EPOXY | TFBGA | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 500 µm | BOTTOM | 11 mm | 13.5 mm | 1.16 mm | MICROSEMI CORP | TFBGA, BGA325,21X21,20 | not_compliant | 8542.39.00.01 | Microsemi Corporation |