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AM27C128-250DE
AMD
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Check for Price | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 120 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | WDIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||
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AM27C128-70/BXA
AMD
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Check for Price | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 70 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | WDIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||
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AM27C128-305LCB
AMD
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Check for Price | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 300 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | R-CQCC-N32 | Not Qualified | e0 | 70 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | WQCCN, LCC32,.45X.55 | 32 | unknown | EAR99 | 8542.32.00.61 | ||||
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AM27C128-300DIB
AMD
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Check for Price | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 300 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-GDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | WDIP, DIP28,.6 | 28 | unknown | EAR99 | 8542.32.00.61 | |||
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AM27C128-120DEB
Rochester Electronics LLC
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Check for Price | Contact Manufacturer | 131.072 kbit | 8 | 16KX8 | 5 V | 120 ns | UVPROM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | ROCHESTER ELECTRONICS LLC | DIP, | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||||||||||
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AM27C128-125DC
Rochester Electronics LLC
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Check for Price | Contact Manufacturer | 131.072 kbit | 8 | 16KX8 | 5 V | 120 ns | UVPROM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | R-GDIP-T28 | 70 °C | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ROCHESTER ELECTRONICS LLC | DIP, | unknown | EAR99 | 8542.32.00.61 | |||||||||||||||
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AM27C128-90DE
AMD
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Check for Price | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 90 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 120 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP | DIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||
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AM27C128-150DEB
AMD
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Check for Price | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 120 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP | DIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||
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AM27C128-250/BUA
AMD
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Check for Price | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 120 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | WQCCN, LCC32,.45X.55 | 32 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||
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NM27C128QM150
Fairchild Semiconductor Corporation
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Check for Price | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 150 ns | COMMON | 16000 | 16.384 k | 3-STATE | 12.75 V | 100 µA | 35 µA | CMOS | MILITARY | R-XDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | FAIRCHILD SEMICONDUCTOR CORP | DIP, DIP28,.6 | unknown | 3A001.A.2.C | 8542.32.00.61 |