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LXT317PE
Inphi Corporation
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Check for Price | Transferred | 5 V | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-J28 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | INPHI CORP | QCCJ, | compliant | 8542.39.00.01 | ||||||||
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LXT317PE
Level One
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Check for Price | No | Transferred | 5 V | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-J28 | e0 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | LEVEL ONE | QCCJ, LDCC28,.5SQ | unknown | 8542.39.00.01 | QLCC | 28 | |||||
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LXT317PE
Intel Corporation
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Check for Price | No | Transferred | 5 V | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-J28 | e0 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | INTEL CORP | QCCJ, LDCC28,.5SQ | compliant | 8542.39.00.01 | QLCC | 28 | ||
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LXT317PE
Cortina Systems Inc
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Check for Price | Transferred | 5 V | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-J28 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | CORTINA SYSTEMS INC | QCCJ, | compliant | 8542.39.00.01 | QLCC | 28 |