Parametric results for: LTC2248IUH under Analog to Digital Converters
Filter Your Search
1 - 8 of 8 results
|
Select parts from the table below to compare.
Compare
Compare
|
|
LTC2248IUH#PBF
Analog Devices Inc
|
$64.8437 | No | Yes | Active | 3 V | 1.9 V | 1 | 0.0244 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | ANALOG DEVICES INC | 5 X 5 MM, LEAD FREE, PLASTIC, MO-220WHHD-X, QFN-32 | 32 | 05-08-1693 | compliant | Analog Devices | ||||||
|
|
LTC2248IUH
Analog Devices Inc
|
Check for Price | No | Obsolete | 3 V | 1.9 V | 1 | 0.0244 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | ANALOG DEVICES INC | 5 X 5 MM, PLASTIC, MO-220WHHD-X, QFN-32 | not_compliant | Analog Devices | 3A991.C.3 | 8542.39.00.01 | |||||||||
|
LTC2248IUH#TR
Linear Technology
|
Check for Price | No | No | Transferred | 3 V | 1.9 V | 1 | 0.0244 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | HVQCCN, LCC32,.2SQ,20 | 32 | not_compliant | 3A991.C.3 | 8542.39.00.01 | QFN | ||||||
|
|
LTC2248IUH#TRPBF
Analog Devices Inc
|
Check for Price | No | Yes | Active | 3 V | 1.9 V | 1 | 0.0244 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | ANALOG DEVICES INC | 5 X 5 MM, LEAD FREE, PLASTIC, MO-220WHHD-X, QFN-32 | 32 | 05-08-1693 | compliant | Analog Devices | ||||||
|
|
LTC2248IUH#TRPBF
Linear Technology
|
Check for Price | Yes | Transferred | 3 V | 1.9 V | 1 | 0.0244 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | 5 X 5 MM, LEAD FREE, PLASTIC, MO-220WHHD-X, QFN-32 | 32 | UH | compliant | 3A991.C.3 | 8542.39.00.01 | QFN | ||||
|
|
LTC2248IUH#TR
Analog Devices Inc
|
Check for Price | No | Obsolete | 3 V | 1.9 V | 1 | 0.0244 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | ANALOG DEVICES INC | 5 X 5 MM, PLASTIC, MO-220WHHD-X, QFN-32 | not_compliant | 3A991.C.3 | 8542.39.00.01 | ||||||||||
|
|
LTC2248IUH#PBF
Linear Technology
|
Check for Price | Yes | Transferred | 3 V | 1.9 V | 1 | 0.0244 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | 5 X 5 MM, LEAD FREE, PLASTIC, MO-220WHHD-X, QFN-32 | 32 | UH | compliant | 3A991.C.3 | 8542.39.00.01 | QFN | ||||
|
|
LTC2248IUH
Linear Technology
|
Check for Price | No | Transferred | 3 V | 1.9 V | 1 | 0.0244 % | 14 | 65 MHz | YES | ADC, PROPRIETARY METHOD | 1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | 5 X 5 MM, PLASTIC, MO-220WHHD-X, QFN-32 | 32 | UH | not_compliant | 3A991.C.3 | 8542.39.00.01 | QFN |