Parametric results for: LTC2233 under Analog to Digital Converters
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LTC2233CUK#PBF
Linear Technology
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$6.2912 | Yes | Transferred | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | LINEAR TECHNOLOGY CORP | QFN | 7 X 7 MM, PLASTIC, LEAD FREE, MO-220-WKKD-2, QFN-48 | 48 | UK | compliant | 8542.39.00.01 | |||||
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LTC2233IUK#PBF
Linear Technology
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$9.5574 | Yes | Transferred | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | LINEAR TECHNOLOGY CORP | QFN | 7 X 7 MM, PLASTIC, LEAD FREE, MO-220-WKKD-2, QFN-48 | 48 | UK | compliant | 8542.39.00.01 | ||||
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LTC2233CUK
Linear Technology
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Check for Price | No | Transferred | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e0 | 1 | 70 °C | 48 | PLASTIC/EPOXY | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | LINEAR TECHNOLOGY CORP | QFN | HVQCCN, LCC48,.27SQ,20 | 48 | UK | not_compliant | 8542.39.00.01 | |||||||
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LTC2233CUK#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | LINEAR TECHNOLOGY CORP | QFN | 7 X 7 MM, PLASTIC, LEAD FREE, MO-220-WKKD-2, QFN-48 | 48 | UK | compliant | 8542.39.00.01 | |||||
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LTC2233CUK#PBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | ANALOG DEVICES INC | 7 X 7 MM, PLASTIC, LEAD FREE, MO-220-WKKD-2, QFN-48 | 48 | 05-08-1704 | compliant | Analog Devices | ||||||
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LTC2233CUK#TRPBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | ANALOG DEVICES INC | 7 X 7 MM, PLASTIC, LEAD FREE, MO-220-WKKD-2, QFN-48 | 48 | 05-08-1704 | compliant | Analog Devices | ||||||
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LTC2233IUK#TR
Analog Devices Inc
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Check for Price | No | Obsolete | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | ANALOG DEVICES INC | 7 X 7 MM, PLASTIC, MO-220-WKKD-2, QFN-48 | not_compliant | 8542.39.00.01 | ||||||||||
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LTC2233IUK
Linear Technology
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Check for Price | No | Transferred | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | LINEAR TECHNOLOGY CORP | QFN | HVQCCN, LCC48,.27SQ,20 | 48 | UK | not_compliant | 8542.39.00.01 | ||||||
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LTC2233IUK
Analog Devices Inc
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Check for Price | No | Obsolete | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | ANALOG DEVICES INC | 7 X 7 MM, PLASTIC, MO-220-WKKD-2, QFN-48 | not_compliant | 8542.39.00.01 | Analog Devices | |||||||||
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LTC2233IUK#TRPBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 3.3 V | 1 V | 1 | 0.0781 % | 10 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 800 µm | 7 mm | ANALOG DEVICES INC | 7 X 7 MM, PLASTIC, LEAD FREE, MO-220-WKKD-2, QFN-48 | 48 | 05-08-1704 | compliant | Analog Devices |