Parametric results for: LTC2229IUH#TRPBF under Analog to Digital Converters
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LTC2229IUH#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 3 V | 1 V | 1 | 0.0269 % | 12 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | LINEAR TECHNOLOGY CORP | QFN | 5 X 5 MM, PLASTIC, MO-220-WHHD, QFN-32 | 32 | UH | compliant | 8542.39.00.01 | ||||
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LTC2229IUH#TRPBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 3 V | 1 V | 1 | 0.0269 % | 12 | 80 MHz | YES | ADC, PROPRIETARY METHOD | -500 mV | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | ANALOG DEVICES INC | 5 X 5 MM, PLASTIC, MO-220-WHHD, QFN-32 | 32 | 05-08-1693 | compliant | 8542.39.00.01 | Analog Devices |