Parametric results for: LT5526EUF under Cellular Telephone Circuits
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LT5526EUF#PBF
Linear Technology
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$3.3136 | Yes | Transferred | 5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 4 mm | 800 µm | LINEAR TECHNOLOGY CORP | QFN | 4 X 4 MM, PLASTIC, MO-220-WGGC, QFN-16 | 16 | UF | compliant | EAR99 | 8542.39.00.01 | |||||
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LT5526EUF#PBF
Analog Devices Inc
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$10.1551 | No | Yes | Active | 5 V | BIPOLAR | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 4 mm | 800 µm | ANALOG DEVICES INC | 4 X 4 MM, PLASTIC, MO-220-WGGC, QFN-16 | 16 | 05-08-1692 | compliant | Analog Devices | |||||
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LT5526EUF#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 4 mm | 800 µm | LINEAR TECHNOLOGY CORP | QFN | 4 X 4 MM, PLASTIC, MO-220-WGGC, QFN-16 | 16 | UF | compliant | 8542.39.00.01 | ||||||
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LT5526EUF
Linear Technology
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Check for Price | No | Transferred | 5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N16 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | QUAD | 4 mm | 4 mm | 800 µm | LINEAR TECHNOLOGY CORP | QFN | HVQCCN, | 16 | UF | not_compliant | EAR99 | 8542.39.00.01 | |||||||
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LT5526EUF#TR
Linear Technology
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Check for Price | No | Transferred | 5 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N16 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 650 µm | QUAD | 4 mm | 4 mm | 800 µm | LINEAR TECHNOLOGY CORP | QFN | HVQCCN, | 16 | UF | compliant | 8542.39.00.01 | ||||||||
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LT5526EUF#TRPBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 5 V | BIPOLAR | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 4 mm | 800 µm | ANALOG DEVICES INC | 4 X 4 MM, PLASTIC, MO-220-WGGC, QFN-16 | 16 | 05-08-1692 | compliant | Analog Devices | |||||
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LT5526EUF#TR
Analog Devices Inc
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Check for Price | No | Obsolete | 5 V | BIPOLAR | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N16 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Tin/Lead (Sn/Pb) | NO LEAD | 650 µm | QUAD | 4 mm | 4 mm | 800 µm | ANALOG DEVICES INC | 4 X 4 MM, PLASTIC, MO-220-WGGC, QFN-16 | compliant | 8542.39.00.01 | ||||||||||
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LT5526EUF
Analog Devices Inc
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Check for Price | No | Obsolete | 5 V | BIPOLAR | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N16 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Tin/Lead (Sn/Pb) | NO LEAD | 650 µm | QUAD | 4 mm | 4 mm | 800 µm | ANALOG DEVICES INC | 4 X 4 MM, PLASTIC, MO-220WGGC, QFN-16 | not_compliant | EAR99 | 8542.39.00.01 | Analog Devices |