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LSI53C140I2
LSI Corporation
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Check for Price | No | No | Transferred | 3.3 V | INTERFACE CIRCUIT | 1 | 3.47 V | 3.13 V | YES | COMMERCIAL | S-PBGA-B192 | Not Qualified | e0 | 70 °C | 192 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 2.32 mm | 23 mm | LSI CORP | BGA | BGA, | 192 | compliant | 8542.39.00.01 | ||||
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LSI53C140I2
Avago Technologies
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Check for Price | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 3.47 V | 3.13 V | YES | COMMERCIAL | S-PBGA-B192 | Not Qualified | e0 | 70 °C | 225 | 30 | 192 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 2.32 mm | 23 mm | AVAGO TECHNOLOGIES INC | BGA, | unknown | 8542.39.00.01 | ||||||
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LSI53C140PF
Broadcom Limited
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Check for Price | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 3.47 V | 3.13 V | YES | COMMERCIAL | S-PQFP-G160 | Not Qualified | e0 | 70 °C | 225 | 30 | 160 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | TIN LEAD | GULL WING | 650 µm | QUAD | 28 mm | 4.01 mm | 28 mm | BROADCOM LTD | QFP, | compliant | 8542.39.00.01 | ||||||
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LSI53C140I2
Broadcom Limited
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Check for Price | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 3.47 V | 3.13 V | YES | COMMERCIAL | S-PBGA-B192 | Not Qualified | e0 | 70 °C | 225 | 30 | 192 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 2.32 mm | 23 mm | BROADCOM LTD | BGA, | compliant | 8542.39.00.01 | ||||||
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LSI53C140PF
Avago Technologies
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Check for Price | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 3.47 V | 3.13 V | YES | COMMERCIAL | S-PQFP-G160 | Not Qualified | e0 | 70 °C | 225 | 30 | 160 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | TIN LEAD | GULL WING | 650 µm | QUAD | 28 mm | 4.01 mm | 28 mm | AVAGO TECHNOLOGIES INC | QFP, | unknown | 8542.39.00.01 | ||||||
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LSI53C140IJ
Avago Technologies
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Check for Price | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 3.47 V | 3.13 V | YES | COMMERCIAL | S-PBGA-B192 | Not Qualified | e0 | 70 °C | 225 | 30 | 192 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 2.32 mm | 23 mm | AVAGO TECHNOLOGIES INC | BGA, | unknown | 8542.39.00.01 | ||||||
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LSI53C140PF
LSI Corporation
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Check for Price | No | No | Transferred | 3.3 V | INTERFACE CIRCUIT | 1 | 3.47 V | 3.13 V | YES | COMMERCIAL | S-PQFP-G160 | Not Qualified | e0 | 70 °C | 160 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | TIN LEAD | GULL WING | 650 µm | QUAD | 28 mm | 4.01 mm | 28 mm | LSI CORP | QFP | QFP, | 160 | compliant | 8542.39.00.01 | ||||
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LSI53C140IJ
Broadcom Limited
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Check for Price | Active | 3.3 V | INTERFACE CIRCUIT | 1 | 3.47 V | 3.13 V | YES | COMMERCIAL | S-PBGA-B192 | Not Qualified | e0 | 70 °C | 225 | 30 | 192 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 2.32 mm | 23 mm | BROADCOM LTD | BGA, | compliant | 8542.39.00.01 | ||||||
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LSI53C140IJ
LSI Corporation
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Check for Price | No | No | Transferred | 3.3 V | INTERFACE CIRCUIT | 1 | 3.47 V | 3.13 V | YES | COMMERCIAL | S-PBGA-B192 | Not Qualified | e0 | 70 °C | 192 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 2.32 mm | 23 mm | LSI CORP | BGA | BGA, | 192 | compliant | 8542.39.00.01 |