Findchips: Parametric Search Results for LMX9830SMX


Select Parts		Part Number

		LMX9830SMX/NOPB Texas Instruments
		LMX9830SMX/NOPB National Semiconductor Corporation
		LMX9830SMX National Semiconductor Corporation
		LMX9830SMX Texas Instruments

				Most Relevant				Technical			Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Data Rate	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Not Recommended

2.75 V

CMOS

921 Mbps

TELECOM CIRCUIT

65 µA

AUTOMOTIVE

R-PBGA-B60

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA60,6X10,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

6 mm

9 mm

1.3 mm

TEXAS INSTRUMENTS INC

BGA

FBGA-60

compliant

5A992.C

8517.62.00.20

Check for Price

Yes

Transferred

2.75 V

CMOS

TELECOM CIRCUIT

65 µA

AUTOMOTIVE

R-PBGA-B60

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA60,6X10,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

6 mm

9 mm

1.3 mm

NATIONAL SEMICONDUCTOR CORP

9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, FBGA-60

compliant

8542.39.00.01

Check for Price

Transferred

2.75 V

CMOS

TELECOM CIRCUIT

65 µA

AUTOMOTIVE

R-PBGA-B60

Not Qualified

125 °C

-40 °C

235

PLASTIC/EPOXY

LFBGA

BGA60,6X10,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

6 mm

9 mm

1.3 mm

NATIONAL SEMICONDUCTOR CORP

9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FBGA-60

not_compliant

8542.39.00.01

Check for Price

Obsolete

2.75 V

CMOS

TELECOM CIRCUIT

AUTOMOTIVE

R-PBGA-B60

Not Qualified

125 °C

-40 °C

235

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

6 mm

9 mm

1.3 mm

TEXAS INSTRUMENTS INC

BGA

LFBGA,

not_compliant

8542.39.00.01

Compare

LMX9830SMX/NOPB

Texas Instruments

Check for Price

Yes

Not Recommended

2.75 V

CMOS

921 Mbps

TELECOM CIRCUIT

65 µA

AUTOMOTIVE

R-PBGA-B60

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA60,6X10,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

6 mm

9 mm

1.3 mm

TEXAS INSTRUMENTS INC

BGA

FBGA-60

compliant

5A992.C

8517.62.00.20

LMX9830SMX/NOPB

National Semiconductor Corporation

Check for Price

Yes

Transferred

2.75 V

CMOS

TELECOM CIRCUIT

65 µA

AUTOMOTIVE

R-PBGA-B60

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA60,6X10,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

6 mm

9 mm

1.3 mm

NATIONAL SEMICONDUCTOR CORP

9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, FBGA-60

compliant

8542.39.00.01

LMX9830SMX

National Semiconductor Corporation

Check for Price

Transferred

2.75 V

CMOS

TELECOM CIRCUIT

65 µA

AUTOMOTIVE

R-PBGA-B60

Not Qualified

125 °C

-40 °C

235

PLASTIC/EPOXY

LFBGA

BGA60,6X10,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

6 mm

9 mm

1.3 mm

NATIONAL SEMICONDUCTOR CORP

9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FBGA-60

not_compliant

8542.39.00.01

LMX9830SMX

Texas Instruments

Check for Price

Obsolete

2.75 V

CMOS

TELECOM CIRCUIT

AUTOMOTIVE

R-PBGA-B60

Not Qualified

125 °C

-40 °C

235

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

6 mm

9 mm

1.3 mm

TEXAS INSTRUMENTS INC

BGA

LFBGA,

not_compliant

8542.39.00.01

Parametric results for: LMX9830SMX under Other Telecom ICs