Findchips: Parametric Search Results for LMV243BL


Select Parts		Part Number

		LMV243BL/NOPB Texas Instruments
		LMV243BLX/NOPB Texas Instruments
		LMV243BLX Texas Instruments
		LMV243BLX National Semiconductor Corporation
		LMV243BL Texas Instruments

			Most Relevant		Technical			Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Obsolete

2.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

NATIONAL SEMICONDUCTOR CORP

TFBGA,

compliant

8542.39.00.01

Check for Price

Yes

Obsolete

2.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

NATIONAL SEMICONDUCTOR CORP

TFBGA,

compliant

8542.39.00.01

Check for Price

Obsolete

2.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B8

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

TEXAS INSTRUMENTS INC

MICRO, BUMP, SMD-8

unknown

8542.39.00.01

BGA

Check for Price

Obsolete

2.8 V

TELECOM CIRCUIT

12.5 µA

INDUSTRIAL

S-PBGA-B8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA8,3X3,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

NATIONAL SEMICONDUCTOR CORP

1.50 X 1.50 MM, 0.995 MM HEIGHT, MICRO, BUMP, SMD-8

not_compliant

Check for Price

Obsolete

2.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B8

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

TEXAS INSTRUMENTS INC

TFBGA,

unknown

8542.39.00.01

BGA

Compare

LMV243BL/NOPB

Texas Instruments

Check for Price

Yes

Obsolete

2.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

NATIONAL SEMICONDUCTOR CORP

TFBGA,

compliant

8542.39.00.01

LMV243BLX/NOPB

Texas Instruments

Check for Price

Yes

Obsolete

2.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

NATIONAL SEMICONDUCTOR CORP

TFBGA,

compliant

8542.39.00.01

LMV243BLX

Texas Instruments

Check for Price

Obsolete

2.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B8

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

TEXAS INSTRUMENTS INC

MICRO, BUMP, SMD-8

unknown

8542.39.00.01

BGA

LMV243BLX

National Semiconductor Corporation

Check for Price

Obsolete

2.8 V

TELECOM CIRCUIT

12.5 µA

INDUSTRIAL

S-PBGA-B8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA8,3X3,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn63Pb37)

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

NATIONAL SEMICONDUCTOR CORP

1.50 X 1.50 MM, 0.995 MM HEIGHT, MICRO, BUMP, SMD-8

not_compliant

LMV243BL

Texas Instruments

Check for Price

Obsolete

2.8 V

TELECOM CIRCUIT

INDUSTRIAL

S-PBGA-B8

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

500 µm

BOTTOM

1.514 mm

1.095 mm

TEXAS INSTRUMENTS INC

TFBGA,

unknown

8542.39.00.01

BGA

Parametric results for: LMV243BL under Other Telecom ICs