Filter Your Search
1 - 8 of 8 results
|
LM3207TLX-2.53/NOPB
National Semiconductor Corporation
|
Check for Price | Yes | Transferred | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.3 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | COMMERCIAL EXTENDED | S-PBGA-B9 | e1 | Not Qualified | 1 | 85 °C | -30 °C | 260 | 40 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.97 mm | 1.97 mm | 675 µm | NATIONAL SEMICONDUCTOR CORP | VFBGA, BGA9,3X3,20 | compliant | EAR99 | 8542.39.00.01 | |||||
|
LM3207TLX-2.53/NOPB
Texas Instruments
|
Check for Price | No | Yes | Obsolete | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.3 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | COMMERCIAL EXTENDED | S-PBGA-B9 | e1 | Not Qualified | 1 | 85 °C | -30 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.97 mm | 1.97 mm | 675 µm | TEXAS INSTRUMENTS INC | VFBGA, BGA9,3X3,20 | compliant | EAR99 | 8542.39.00.01 | BGA | 9 | ||
|
LM3207TLX/NOPB
Texas Instruments
|
Check for Price | No | Yes | Obsolete | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.3 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | COMMERCIAL EXTENDED | S-PBGA-B9 | e1 | Not Qualified | 1 | 85 °C | -30 °C | 260 | 30 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.97 mm | 1.97 mm | 675 µm | TEXAS INSTRUMENTS INC | VFBGA, BGA9,3X3,20 | compliant | EAR99 | 8542.39.00.01 | BGA | 9 | ||
|
LM3207TLX/NOPB
National Semiconductor Corporation
|
Check for Price | Yes | Transferred | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.3 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | COMMERCIAL EXTENDED | S-PBGA-B9 | e1 | Not Qualified | 1 | 85 °C | -30 °C | 260 | 40 | 9 | PLASTIC/EPOXY | VFBGA | BGA9,3X3,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.97 mm | 1.97 mm | 675 µm | NATIONAL SEMICONDUCTOR CORP | VFBGA, BGA9,3X3,20 | compliant | EAR99 | 8542.39.00.01 | |||||
|
LM3207TLX
National Semiconductor Corporation
|
Check for Price | Yes | Transferred | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.3 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | COMMERCIAL EXTENDED | S-XBGA-B9 | e1 | Not Qualified | 1 | 85 °C | -30 °C | 260 | 40 | 9 | UNSPECIFIED | VFBGA | BGA9,3X3,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.97 mm | 1.97 mm | 675 µm | NATIONAL SEMICONDUCTOR CORP | VFBGA, BGA9,3X3,20 | compliant | EAR99 | 8542.39.00.01 | |||||
|
LM3207TLX
Texas Instruments
|
Check for Price | Yes | Yes | Obsolete | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.3 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | COMMERCIAL EXTENDED | S-XBGA-B9 | e1 | Not Qualified | 1 | 85 °C | -30 °C | 9 | UNSPECIFIED | VFBGA | BGA9,3X3,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.97 mm | 1.97 mm | 675 µm | TEXAS INSTRUMENTS INC | VFBGA, | compliant | EAR99 | 8542.39.00.01 | BGA | 9 | ||||
|
LM3207TLX-2.53
Texas Instruments
|
Check for Price | Yes | Yes | Obsolete | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.3 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | COMMERCIAL EXTENDED | S-XBGA-B9 | e1 | Not Qualified | 1 | 85 °C | -30 °C | 9 | UNSPECIFIED | VFBGA | BGA9,3X3,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.97 mm | 1.97 mm | 675 µm | TEXAS INSTRUMENTS INC | VFBGA, | compliant | EAR99 | 8542.39.00.01 | BGA | 9 | ||||
|
LM3207TLX-2.53
National Semiconductor Corporation
|
Check for Price | Yes | Transferred | 3.6 V | 5.5 V | 2.7 V | 1.2 A | YES | BUCK | 2.3 MHz | SWITCHING REGULATOR | CURRENT-MODE | PULSE WIDTH MODULATION | 1 | COMMERCIAL EXTENDED | S-XBGA-B9 | e1 | Not Qualified | 1 | 85 °C | -30 °C | 260 | 40 | 9 | UNSPECIFIED | VFBGA | BGA9,3X3,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.97 mm | 1.97 mm | 675 µm | NATIONAL SEMICONDUCTOR CORP | VFBGA, BGA9,3X3,20 | compliant | EAR99 | 8542.39.00.01 |