Parametric results for: LE58QL021VC under Codecs

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Manufacturer Part Number: le58ql021vc
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LE58QL021VC
Legerity
Check for Price No Transferred 3.3 V CMOS SYNCHRONOUS PCM CODEC A/MU-LAW YES 1 INDUSTRIAL S-PQFP-G44 e0 Not Qualified 3 85 °C -40 °C 235 44 PLASTIC/EPOXY TQFP SQUARE FLATPACK, THIN PROFILE YES TIN LEAD GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm LEGERITY INC QFP MS-026ACB, TQFP-44 44 unknown 8542.39.00.01
LE58QL021VC
Microchip Technology Inc
Check for Price End Of Life 3.3 V CMOS SYNCHRONOUS PCM CODEC A/MU-LAW YES 1 INDUSTRIAL S-PQFP-G44 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 44 PLASTIC/EPOXY TQFP SQUARE FLATPACK, THIN PROFILE YES GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm MICROCHIP TECHNOLOGY INC MS-026ACB, TQFP-44 compliant
LE58QL021VC
Microsemi Corporation
Check for Price No Transferred 3.3 V CMOS SYNCHRONOUS PCM CODEC A/MU-LAW YES 1 INDUSTRIAL S-PQFP-G44 e0 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 44 PLASTIC/EPOXY TQFP SQUARE FLATPACK, THIN PROFILE YES TIN LEAD GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm MICROSEMI CORP QFP MS-026ACB, TQFP-44 44 compliant 8542.39.00.01
LE58QL021VC
Zarlink Semiconductor Inc
Check for Price Transferred 3.3 V CMOS SYNCHRONOUS PCM CODEC A/MU-LAW YES 1 INDUSTRIAL S-PQFP-G44 e0 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 44 PLASTIC/EPOXY TQFP SQUARE FLATPACK, THIN PROFILE YES TIN LEAD GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm ZARLINK SEMICONDUCTOR INC MS-026ACB, TQFP-44 unknown 8542.39.00.01