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Parametric » Telecommunication Circuits » Analog Transmission Interfaces

Parametric results for: LE57D121 under Analog Transmission Interfaces

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Manufacturer Part Number: le57d121
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LE57D121BTCT
 Microchip Technology Inc 		Check for Price Yes Obsolete 5 V 12 dBrnC SLIC CONSTANT CURRENT -39 TO -60 V 2-4 CONVERSION 1 20 dB 13 mA INDUSTRIAL S-PQFP-G44 e3 Not Qualified 85 °C -40 °C 44 PLASTIC/EPOXY HTQFP TQFP44,.47SQ,32 SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm MICROCHIP TECHNOLOGY INC TQFP-44 compliant
LE57D121BTCT
 Zarlink Semiconductor Inc 		Check for Price Yes Transferred 5 V 12 dBrnC SLIC -39 TO -60 V 1 28 dB 13 µA INDUSTRIAL S-PQFP-G44 e3 Not Qualified 85 °C -40 °C 44 PLASTIC/EPOXY HTQFP TQFP44,.47SQ,32 SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm ZARLINK SEMICONDUCTOR INC GREEN, TQFP-44 unknown 8542.39.00.01
LE57D121BTCT
 Microsemi Corporation 		Check for Price Yes Transferred 5 V SLIC 1 INDUSTRIAL S-PQFP-G44 e3 Not Qualified 85 °C -40 °C 44 PLASTIC/EPOXY HTQFP SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm MICROSEMI CORP TQFP-44 compliant 8542.39.00.01 QFP 44
LE57D121TC
 Microsemi Corporation 		Check for Price No No Transferred 5 V 12 dBrnC SLIC -39 TO -60 V 1 28 dB 13 mA COMMERCIAL S-PQFP-G44 Not Qualified 70 °C 44 PLASTIC/EPOXY HTQFP TQFP44,.47SQ,32 SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm MICROSEMI CORP TQFP-44 unknown 8542.39.00.01 QFP 44
LE57D121TC
 Legerity 		Check for Price Transferred 5 V SLIC 1 COMMERCIAL S-PQFP-G44 Not Qualified 70 °C 44 PLASTIC/EPOXY HTQFP SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm LEGERITY INC HTQFP, unknown 8542.39.00.01 QFP 44
LE57D121BTC
 Microsemi Corporation 		Check for Price Yes Transferred 5 V SLIC 1 INDUSTRIAL S-PQFP-G44 e3 Not Qualified 85 °C -40 °C 44 PLASTIC/EPOXY HTQFP SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm MICROSEMI CORP TQFP-44 compliant 8542.39.00.01 QFP 44
LE57D121BTC
 Microchip Technology Inc 		Check for Price Yes Obsolete 5 V 12 dBrnC SLIC CONSTANT CURRENT -39 TO -60 V 2-4 CONVERSION 1 20 dB 13 mA INDUSTRIAL S-PQFP-G44 e3 Not Qualified 85 °C -40 °C 44 PLASTIC/EPOXY HTQFP TQFP44,.47SQ,32 SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm MICROCHIP TECHNOLOGY INC TQFP-44 compliant
LE57D121BTC
 Legerity 		Check for Price Transferred 5 V CMOS SLIC 1 INDUSTRIAL S-PQFP-G44 e3 Not Qualified 85 °C -40 °C 44 PLASTIC/EPOXY HTQFP SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES MATTE TIN GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm LEGERITY INC GREEN, TQFP-44 unknown 8542.39.00.01 QFP 44
LE57D121TC
 Zarlink Semiconductor Inc 		Check for Price No Transferred 5 V 12 dBrnC SLIC -39 TO -60 V 1 28 dB 13 µA COMMERCIAL S-PQFP-G44 Not Qualified 70 °C 44 PLASTIC/EPOXY HTQFP TQFP44,.47SQ,32 SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm ZARLINK SEMICONDUCTOR INC HTQFP, TQFP44,.47SQ,32 unknown 8542.39.00.01
LE57D121BTC
 Zarlink Semiconductor Inc 		Check for Price Yes Transferred 5 V 12 dBrnC SLIC -39 TO -60 V 1 28 dB 13 µA INDUSTRIAL S-PQFP-G44 e3 Not Qualified 85 °C -40 °C 44 PLASTIC/EPOXY HTQFP TQFP44,.47SQ,32 SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm QUAD 10 mm 10 mm 1.2 mm ZARLINK SEMICONDUCTOR INC GREEN, TQFP-44 unknown 8542.39.00.01
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