Findchips.com

Register or Sign In

Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: KMPC860DEZQ50D4 under Microprocessors

Select parts from the table below to compare.

Compare


	Part Number

Microcontrollers and Processors

KMPC860DEZQ50D4

Freescale Semiconductor

			Most Relevant							Technical								Compliance		Operating Conditions			Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

No

Obsolete

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

3

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

357

not_compliant

5A991

8542.31.00.01

Compare

Microcontrollers and Processors

KMPC860DEZQ50D4

Freescale Semiconductor

Check for Price

No

Obsolete

32

50 MHz

32

32

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

3

245

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

357

not_compliant

5A991

8542.31.00.01