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KM23C4100AFP1-25
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 250 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQFP-G44 | Not Qualified | e0 | 70 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQFP | QFP44,.7SQ,32 | SQUARE | FLATPACK, WINDOW | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 2.8 mm | 14 mm | 14 mm | SAMSUNG SEMICONDUCTOR INC | QFP | WQFP, QFP44,.7SQ,32 | 44 | compliant | EAR99 | 8542.32.00.71 | ||
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KM23C4100AFP1-15
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 150 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQFP-G44 | Not Qualified | e0 | 70 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQFP | QFP44,.7SQ,32 | SQUARE | FLATPACK, WINDOW | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 2.8 mm | 14 mm | 14 mm | SAMSUNG SEMICONDUCTOR INC | QFP | WQFP, QFP44,.7SQ,32 | 44 | unknown | EAR99 | 8542.32.00.71 | ||
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KM23C4100A-15
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 150 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 52.43 mm | 15.24 mm | SAMSUNG SEMICONDUCTOR INC | DIP | DIP, DIP40,.6 | 40 | unknown | EAR99 | 8542.32.00.71 | ||
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KM23C4100A-20
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 200 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 52.43 mm | 15.24 mm | SAMSUNG SEMICONDUCTOR INC | DIP | DIP, DIP40,.6 | 40 | unknown | EAR99 | 8542.32.00.71 | ||
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KM23C4100AFP2-25
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 250 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQFP-G44 | Not Qualified | e0 | 70 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQFP | TQFP44,.6SQ,32 | SQUARE | FLATPACK, WINDOW | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | SAMSUNG SEMICONDUCTOR INC | QFP | WQFP, TQFP44,.6SQ,32 | 44 | compliant | EAR99 | 8542.32.00.71 | |||
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KM23C4100AFP2-12
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 120 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQFP-G44 | Not Qualified | e0 | 70 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQFP | TQFP44,.6SQ,32 | SQUARE | FLATPACK, WINDOW | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | SAMSUNG SEMICONDUCTOR INC | QFP | WQFP, TQFP44,.6SQ,32 | 44 | unknown | EAR99 | 8542.32.00.71 | |||
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KM23C4100AG-20
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 200 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | SOP | SOP40,.56 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.8 mm | 26.2 mm | 10.67 mm | SAMSUNG SEMICONDUCTOR INC | SOIC | SOP, SOP40,.56 | 40 | compliant | EAR99 | 8542.32.00.71 | ||
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KM23C4100AG-25
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 250 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G40 | Not Qualified | e0 | 70 °C | 40 | PLASTIC/EPOXY | SOP | SOP40,.56 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.8 mm | 26.2 mm | 10.67 mm | SAMSUNG SEMICONDUCTOR INC | SOIC | SOP, SOP40,.56 | 40 | compliant | EAR99 | 8542.32.00.71 | ||
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KM23C4100AFP1-20
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 200 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQFP-G44 | Not Qualified | e0 | 70 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQFP | QFP44,.7SQ,32 | SQUARE | FLATPACK, WINDOW | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 2.8 mm | 14 mm | 14 mm | SAMSUNG SEMICONDUCTOR INC | QFP | WQFP, QFP44,.7SQ,32 | 44 | unknown | EAR99 | 8542.32.00.71 | ||
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KM23C4100AFP2-15
Samsung Semiconductor
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Check for Price | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 150 ns | MASK ROM | 16 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 50 µA | 50 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CQFP-G44 | Not Qualified | e0 | 70 °C | 44 | CERAMIC, METAL-SEALED COFIRED | WQFP | TQFP44,.6SQ,32 | SQUARE | FLATPACK, WINDOW | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | SAMSUNG SEMICONDUCTOR INC | QFP | WQFP, TQFP44,.6SQ,32 | 44 | unknown | EAR99 | 8542.32.00.71 |