Register or Sign In
Parametric » Memory » SRAMs

Parametric results for: K7D161871B-GC30 under SRAMs

Filter Your Search

1 - 10 of 10 results

|
-
10 hits
10 hits
-
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
10 hits
Manufacturer Part Number: k7d161871b
Select parts from the table below to compare.
 Compare
Compare
K7D161871B-HC37T
 Samsung Semiconductor 		Check for Price No No Obsolete 18.8744 Mbit 18 1MX18 1.7 ns 375 MHz APPLICATION SPECIFIC SRAM COMMON 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 100 mA 2.37 V 450 µA CMOS COMMERCIAL R-PBGA-B153 Not Qualified 1 70 °C 153 PLASTIC/EPOXY BGA BGA153,9X17,50 RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM SAMSUNG SEMICONDUCTOR INC BGA, BGA153,9X17,50 compliant 3A991.B.2.A 8542.32.00.41
K7D161871B-HC37
 Samsung Semiconductor 		Check for Price No No Obsolete 18.8744 Mbit 18 1MX18 2.5 V 1.7 ns 375 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 100 mA 2.37 V 450 µA 2.63 V 2.37 V CMOS COMMERCIAL R-PBGA-B153 Not Qualified e0 3 70 °C 153 PLASTIC/EPOXY HBGA BGA153,9X17,50 RECTANGULAR GRID ARRAY, HEAT SINK/SLUG YES TIN LEAD BALL 1.27 mm BOTTOM 2.21 mm 22 mm 14 mm SAMSUNG SEMICONDUCTOR INC HBGA, BGA153,9X17,50 unknown 3A991.B.2.A 8542.32.00.41
K7D161871B-HC330
 Samsung Semiconductor 		Check for Price No Obsolete 18.8744 Mbit 18 1MX18 2.5 V 200 ps 333 MHz DDR SRAM PIPELINED ARCHITECTURE COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 100 mA 2.37 V 500 µA 2.63 V 2.37 V CMOS COMMERCIAL R-PBGA-B153 Not Qualified 1 70 °C 153 PLASTIC/EPOXY BGA BGA153,9X17,50 RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM 2.21 mm 22 mm 14 mm SAMSUNG SEMICONDUCTOR INC BGA, BGA153,9X17,50 compliant 3A991.B.2.A 8542.32.00.41 BGA 153
K7D161871B-HC33T
 Samsung Semiconductor 		Check for Price No No Obsolete 18.8744 Mbit 18 1MX18 1.7 ns 333 MHz APPLICATION SPECIFIC SRAM COMMON 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 100 mA 2.37 V 500 µA CMOS COMMERCIAL R-PBGA-B153 Not Qualified 1 70 °C 153 PLASTIC/EPOXY BGA BGA153,9X17,50 RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM SAMSUNG SEMICONDUCTOR INC BGA, BGA153,9X17,50 compliant 3A991.B.2.A 8542.32.00.41
K7D161871B-HC40
 Samsung Semiconductor 		Check for Price No No Obsolete 18.8744 Mbit 18 1MX18 400 MHz STANDARD SRAM COMMON 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 150 mA 2.37 V CMOS COMMERCIAL R-PBGA-B153 Not Qualified e0 3 70 °C 153 PLASTIC/EPOXY BGA BGA153,9X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM SAMSUNG SEMICONDUCTOR INC BGA, BGA153,9X17,50 unknown 3A991.B.2.A 8542.32.00.41
K7D161871B-HC300
 Samsung Semiconductor 		Check for Price No Obsolete 18.8744 Mbit 18 1MX18 2.5 V 200 ps 300 MHz DDR SRAM PIPELINED ARCHITECTURE COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 100 mA 2.37 V 350 µA 2.63 V 2.37 V CMOS COMMERCIAL R-PBGA-B153 Not Qualified 1 70 °C 153 PLASTIC/EPOXY BGA BGA153,9X17,50 RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM 2.21 mm 22 mm 14 mm SAMSUNG SEMICONDUCTOR INC BGA, BGA153,9X17,50 compliant 3A991.B.2.A 8542.32.00.41 BGA 153
K7D161871B-HC30T
 Samsung Semiconductor 		Check for Price No No Obsolete 18.8744 Mbit 18 1MX18 1.9 ns 300 MHz APPLICATION SPECIFIC SRAM COMMON 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 100 mA 2.37 V 350 µA CMOS COMMERCIAL R-PBGA-B153 Not Qualified 1 70 °C 153 PLASTIC/EPOXY BGA BGA153,9X17,50 RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM SAMSUNG SEMICONDUCTOR INC BGA, BGA153,9X17,50 compliant 3A991.B.2.A 8542.32.00.41
K7D161871B-HC370
 Samsung Semiconductor 		Check for Price No Obsolete 18.8744 Mbit 18 1MX18 2.5 V 200 ps 375 MHz DDR SRAM PIPELINED ARCHITECTURE COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 100 mA 2.37 V 450 µA 2.63 V 2.37 V CMOS COMMERCIAL R-PBGA-B153 Not Qualified 1 70 °C 153 PLASTIC/EPOXY BGA BGA153,9X17,50 RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM 2.21 mm 22 mm 14 mm SAMSUNG SEMICONDUCTOR INC BGA, BGA153,9X17,50 compliant 3A991.B.2.A 8542.32.00.41 BGA 153
K7D161871B-HC30
 Samsung Semiconductor 		Check for Price No No Obsolete 18.8744 Mbit 18 1MX18 2.5 V 1.9 ns 300 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 100 mA 2.37 V 350 µA 2.63 V 2.37 V CMOS COMMERCIAL R-PBGA-B153 Not Qualified e0 3 70 °C 153 PLASTIC/EPOXY HBGA BGA153,9X17,50 RECTANGULAR GRID ARRAY, HEAT SINK/SLUG YES TIN LEAD BALL 1.27 mm BOTTOM 2.21 mm 22 mm 14 mm SAMSUNG SEMICONDUCTOR INC HBGA, BGA153,9X17,50 unknown 3A991.B.2.A 8542.32.00.41
K7D161871B-HC33
 Samsung Semiconductor 		Check for Price No No Obsolete 18.8744 Mbit 18 1MX18 2.5 V 1.7 ns 333 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 100 mA 2.37 V 500 µA 2.63 V 2.37 V CMOS COMMERCIAL R-PBGA-B153 Not Qualified e0 3 70 °C 153 PLASTIC/EPOXY HBGA BGA153,9X17,50 RECTANGULAR GRID ARRAY, HEAT SINK/SLUG YES TIN LEAD BALL 1.27 mm BOTTOM 2.21 mm 22 mm 14 mm SAMSUNG SEMICONDUCTOR INC HBGA, BGA153,9X17,50 unknown 3A991.B.2.A 8542.32.00.41