Parametric results for: K6F1016U4B under SRAMs

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Manufacturer Part Number: k6f1016u4b
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K6F1016U4B-FF55
Samsung Semiconductor
Check for Price No Obsolete 1.0486 Mbit 16 64KX16 3 V 55 ns STANDARD SRAM COMMON 1 64000 65.536 k ASYNCHRONOUS 3-STATE PARALLEL 1 µA 1.5 V 35 µA 3.3 V 2.7 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 750 µm BOTTOM 1.2 mm 7 mm 6 mm SAMSUNG SEMICONDUCTOR INC BGA 6 X 7 MM, 0.75 MM PITCH, FBGA-48 48 compliant EAR99 8542.32.00.41
K6F1016U4B-FF55T
Samsung Semiconductor
Check for Price No Obsolete 1.0486 Mbit 16 64KX16 3 V 55 ns STANDARD SRAM COMMON 64000 65.536 k ASYNCHRONOUS 3-STATE PARALLEL 1 µA 1.5 V 35 µA CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY FBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 750 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA48,6X8,30 compliant EAR99 8542.32.00.41
K6F1016U4B-FF70T
Samsung Semiconductor
Check for Price No Obsolete 1.0486 Mbit 16 64KX16 3 V 70 ns STANDARD SRAM COMMON 64000 65.536 k ASYNCHRONOUS 3-STATE PARALLEL 1 µA 1.5 V 35 µA CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY FBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 750 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA48,6X8,30 compliant EAR99 8542.32.00.41
K6F1016U4B-FF70
Samsung Semiconductor
Check for Price No Obsolete 1.0486 Mbit 16 64KX16 3 V 70 ns STANDARD SRAM COMMON 1 64000 65.536 k ASYNCHRONOUS 3-STATE PARALLEL 1 µA 1.5 V 35 µA 3.3 V 2.7 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 750 µm BOTTOM 1.2 mm 7 mm 6 mm SAMSUNG SEMICONDUCTOR INC BGA TFBGA, BGA48,6X8,30 48 compliant EAR99 8542.32.00.41