Parametric results for: K4N56163QF-GC33 under DRAMs

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Manufacturer Part Number: k4n56163qfgc33
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K4N56163QF-GC330
Samsung Semiconductor
Check for Price No Obsolete 268.4355 Mbit 16 16MX16 1.8 V 470 ps 300 MHz 8192 FOUR BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH COMMON 4,8 1 1 16000000 16.7772 M SYNCHRONOUS 3-STATE YES 4,8 370 µA 1.9 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified e0 95 °C 84 PLASTIC/EPOXY TFBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 13 mm 11 mm SAMSUNG SEMICONDUCTOR INC BGA TFBGA, BGA84,9X15,32 84 compliant EAR99 8542.32.00.24
K4N56163QF-GC33
Samsung Semiconductor
Check for Price No Obsolete 268.4355 Mbit 16 16MX16 1.8 V 470 ps 300 MHz 8192 FOUR BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH COMMON 4,8 1 1 16000000 16.7772 M SYNCHRONOUS 3-STATE YES 4,8 370 µA 1.9 V 1.7 V CMOS OTHER R-PBGA-B84 Not Qualified 95 °C NOT SPECIFIED NOT SPECIFIED 84 PLASTIC/EPOXY TFBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13 mm 11 mm SAMSUNG SEMICONDUCTOR INC BGA TFBGA, BGA84,9X15,32 84 compliant EAR99 8542.32.00.24
K4N56163QF-GC33T
Samsung Semiconductor
Check for Price No Obsolete 268.4355 Mbit 16 16MX16 1.8 V 300 MHz 8192 GDDR2 DRAM COMMON 4,8 16000000 16.7772 M 3-STATE 4,8 370 µA CMOS OTHER R-PBGA-B84 Not Qualified 95 °C 84 PLASTIC/EPOXY FBGA BGA84,9X15,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA84,9X15,32 unknown EAR99 8542.32.00.24