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JANTXV1N6640US
Microchip Technology Inc
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$14.4769 | No | Active | 300 mA | 1 V | 4 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-2 | compliant | |||||||||
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JANTXV1N6640US/TR
Microchip Technology Inc
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$14.4977 | Active | 300 mA | 1 V | 4 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.21.00.40 | |||||||||
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JANTXV1N6640US
Cobham Semiconductor Solutions
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Check for Price | Transferred | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | AEROFLEX/METELICS INC | HERMETIC SEALED GLASS PACKAGE-2 | unknown | EAR99 | 8541.10.00.70 | 2 | ||||||||||||||
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JANTXV1N6640US
Sensitron Semiconductors
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Check for Price | No | No | Active | 300 mA | 1.1 V | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | O-XELF-R2 | MIL-19500/609D | 175 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | SENSITRON SEMICONDUCTOR | SURFACE MOUNT PACKAGE-2 | compliant | EAR99 | 8541.10.00.70 | 2 | |||||||
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JANTXV1N6640US
Compensated Devices Inc
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Check for Price | Transferred | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 1 | Not Qualified | O-XELF-R2 | MIL-19500/609D | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | COMPENSATED DEVICES INC | SURFACE MOUNT PACKAGE-2 | unknown | ||||||||||||||||||
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JANTXV1N6640US
Defense Logistics Agency
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Check for Price | Active | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 1 | Qualified | O-XELF-R2 | MIL-19500/609D | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | SURFACE MOUNT PACKAGE-2 | unknown | |||||||||||||||||
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JANTXV1N6640US
MACOM
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Check for Price | Transferred | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | Qualified | O-LELF-R2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED GLASS PACKAGE-2 | compliant | EAR99 | 8541.10.00.70 | |||||||||||||||
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JANTXV1N6640US
Bkc Semiconductors Inc
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Check for Price | Obsolete | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 1 | Not Qualified | O-XELF-R2 | MIL-19500/609D | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | BKC SEMICONDUCTORS INC | SURFACE MOUNT PACKAGE-2 | unknown | ||||||||||||||||||
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JANTXV1N6640US
Cobham PLC
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Check for Price | Transferred | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COBHAM PLC | HERMETIC SEALED GLASS PACKAGE-2 | unknown | EAR99 | 8541.10.00.70 | |||||||||||||||
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JANTXV1N6640US
Microsemi Corporation
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Check for Price | No | No | Transferred | 300 mA | 1 V | 4 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Not Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | SURFACE MOUNT PACKAGE-2 | not_compliant | EAR99 | 8541.10.00.70 | 2 | Microsemi Corporation |