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JANTX1N6639US
Microchip Technology Inc
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$10.7554 | No | Active | 300 mA | 1.2 V | 4 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-2 | compliant | ||||||||||||
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JANTX1N6639US
Microsemi Corporation
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$12.3981 | No | No | Transferred | 300 mA | 1.2 V | 4 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Not Qualified | O-XELF-R2 | e0 | MIL-19500/609D | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | SURFACE MOUNT PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.70 | Microsemi Corporation | |||||||
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JANTX1N6639US
Cobham Semiconductor Solutions
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Check for Price | Transferred | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | AEROFLEX/METELICS INC | HERMETIC SEALED GLASS PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.70 | |||||||||||||||
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JANTX1N6639US
MACOM
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Check for Price | Transferred | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | Qualified | O-LELF-R2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED GLASS PACKAGE-2 | compliant | EAR99 | 8541.10.00.70 | ||||||||||||||||
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JANTX1N6639US
Compensated Devices Inc
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Check for Price | Transferred | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | Not Qualified | O-XELF-R2 | MIL-19500/609D | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | COMPENSATED DEVICES INC | SURFACE MOUNT PACKAGE-2 | unknown | |||||||||||||||||||||
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JANTX1N6639US
Sensitron Semiconductors
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Check for Price | No | No | Active | 300 mA | 1.2 V | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | MIL-19500/609D | 175 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | SENSITRON SEMICONDUCTOR | SURFACE MOUNT PACKAGE-2 | compliant | 2 | EAR99 | 8541.10.00.70 | |||||||||
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JANTX1N6639US
Bkc Semiconductors Inc
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Check for Price | Obsolete | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | Not Qualified | O-XELF-R2 | MIL-19500/609D | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | BKC SEMICONDUCTORS INC | SURFACE MOUNT PACKAGE-2 | unknown | |||||||||||||||||||||
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JANTX1N6639US
VPT Components
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Check for Price | No | Active | 500 mA | 1.2 V | 4 ns | 100 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | ULTRA FAST RECOVERY | 1 | 75 V | Qualified | O-LELF-R2 | MIL-19500 | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | VPT COMPONENTS | MELF-2 | compliant | EAR99 | 8541.10.00.70 | |||||||||
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JANTX1N6639US
Cobham PLC
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Check for Price | Transferred | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | Not Qualified | O-LELF-R2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COBHAM PLC | HERMETIC SEALED GLASS PACKAGE-2 | unknown | EAR99 | 8541.10.00.70 | ||||||||||||||||
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JANTX1N6639US
Defense Logistics Agency
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Check for Price | Active | 300 mA | 4 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-XELF-R2 | MIL-19500/609D | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | SURFACE MOUNT PACKAGE-2 | unknown |