Parametric results for: JANTX1N3157UR-1 under Zener Diodes

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Manufacturer Part Number: jantx1n3157ur1
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JANTX1N3157UR-1
Compensated Devices Inc
Check for Price Transferred 500 mW 8.4 V SILICON ZENER DIODE SINGLE YES 1 ZENER METALLURGICALLY BONDED 0.084 mV/°C 5 % Not Qualified O-LELF-R2 MIL-19500/158P DO-213AA 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM WRAP AROUND END COMPENSATED DEVICES INC HERMETIC SEALED, GLASS PACKAGE-2 unknown
JANTX1N3157UR-1
Microsemi Corporation
Check for Price No No Transferred 500 mW 8.4 V SILICON ZENER DIODE SINGLE YES 1 ZENER METALLURGICALLY BONDED 0.084 mV/°C 5 % Not Qualified O-LELF-R2 e0 MIL-19500/158P DO-213AA 1 ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP HERMETIC SEALED, GLASS PACKAGE-2 unknown DO-213AA 2 EAR99 8541.10.00.50
JANTX1N3157UR-1
Defense Logistics Agency
Check for Price Active 500 mW 8.4 V SILICON ZENER DIODE SINGLE YES 1 ZENER 5 % Qualified O-LELF-R2 MIL-19500/158P DO-213AA ISOLATED 2 GLASS ROUND LONG FORM WRAP AROUND END DEFENSE LOGISTICS AGENCY HERMETIC SEALED, GLASS PACKAGE-2 unknown
JANTX1N3157UR-1
Microchip Technology Inc
Check for Price No Active 500 mW 8.4 V SILICON ZENER DIODE SINGLE YES 1 ZENER METALLURGICALLY BONDED 0.084 mV/°C 5 % Qualified O-LELF-R2 e0 MIL-19500/158P DO-213AA 1 ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS PACKAGE-2 compliant