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JAN1N823UR-1
Microchip Technology Inc
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$4.9914 | No | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 0.31 mV/°C | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/159M | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, SIMILAR TO DO-213AA, 2 PIN | compliant | ||||||||||||||
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JAN1N823UR-1/TR
Microchip Technology Inc
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$5.1470 | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 0.31 mV/°C | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/159M | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||
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JAN1N823UR-1
Microsemi Corporation
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$5.4930 | No | No | Transferred | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 0.31 mV/°C | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/159M | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, SIMILAR TO DO-213AA, 2 PIN | unknown | EAR99 | 8541.10.00.50 | DO-213AA | 2 | |||||||||
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JAN1N823-1
Microchip Technology Inc
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$6.9596 | No | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 15 Ω | 3 V | 0.31 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||||
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JAN1N823-1/TR
Microchip Technology Inc
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$7.1088 | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 15 Ω | 3 V | 0.31 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||
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JAN1N823
Motorola Mobility LLC
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Check for Price | Obsolete | 7.5 mA | 400 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 0.31 mV/°C | 5 % | Not Qualified | O-LALF-W2 | DO-204AA | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MOTOROLA INC | O-LALF-W2 | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||
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JAN1N823UR
Microsemi Corporation
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Check for Price | No | No | Obsolete | 7.5 mA | 500 mW | 6.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 0.31 mV/°C | 4.84 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/159 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | EAR99 | 8541.10.00.50 | DO-213AA | 2 | |||||||
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JAN1N823UR-1
Defense Logistics Agency
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Check for Price | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | MIL-19500/159M | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS, SIMILAR TO DO-213AA, 2 PIN | unknown | ||||||||||||||||||||
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JAN1N823UR-1
Cobham PLC
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Check for Price | Transferred | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | 0.31 mV/°C | 4.84 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/159M | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COBHAM PLC | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||
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JAN1N823-1
MACOM
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Check for Price | Transferred | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 0.31 mV/°C | 4.84 % | Qualified | O-XALF-W2 | e0 | MIL-19500/159M | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED PACKAGE-2 | compliant | EAR99 | 8541.10.00.50 |