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JAN1N4982
Microchip Technology Inc
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$9.0007 | No | Active | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 40 Ω | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/356H | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||
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JAN1N4982US
Microchip Technology Inc
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$11.5752 | No | Active | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 40 Ω | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | |||||||||
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JAN1N4982C
Microchip Technology Inc
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$23.0420 | No | Active | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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JAN1N4982D
Microchip Technology Inc
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$28.8046 | No | Active | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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JAN1N4982CUS
Microchip Technology Inc
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$29.6194 | No | Active | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 2 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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JAN1N4982DUS
Microchip Technology Inc
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$37.0246 | No | Active | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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JAN1N4982
Defense Logistics Agency
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Check for Price | Active | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 5 % | Qualified | O-LALF-W2 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | |||||||||||||
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JAN1N4982C
Defense Logistics Agency
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Check for Price | Active | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 2 % | Qualified | O-LALF-W2 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | |||||||||||||
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JAN1N4982DUS
Microsemi Corporation
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Check for Price | No | Transferred | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | not_compliant | 2 | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||
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JAN1N4982
Micross Components
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Check for Price | Active | 12 mA | 5 W | 100 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | LOW IMPEDANCE | 40 Ω | 5 % | Qualified | O-XALF-W2 | MIL-19500 | 200 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WIRE | AXIAL | MICROSS COMPONENTS | HERMETIC SEALED PACKAGE-2 | unknown |