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IS61LF25636A-7.5B3I
Integrated Silicon Solution Inc
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Check for Price | No | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | 117 MHz | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 85 mA | 3.14 V | 185 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | INTEGRATED SILICON SOLUTION INC | BGA | 13 X 15 MM, PLASTIC, BGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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IS61LF25636A-7.5B3I
ABLIC Inc.
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Check for Price | Active | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | CACHE SRAM | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | SEIKO INSTRUMENTS USA INC | BGA | TBGA, | 165 | unknown |