Findchips: Parametric Search Results for IDT74SSTVN16859C


Select Parts		Part Number

		IDT74SSTVN16859CPAG Integrated Device Technology Inc
		IDT74SSTVN16859CNL Integrated Device Technology Inc
		IDT74SSTVN16859CNLG Integrated Device Technology Inc
		IDT74SSTVN16859CNL Renesas Electronics Corporation
		IDT74SSTVN16859CPA Renesas Electronics Corporation
		IDT74SSTVN16859CPAG8 Integrated Device Technology Inc
		IDT74SSTVN16859CPA Integrated Device Technology Inc
		IDT74SSTVN16859CNLG8 Integrated Device Technology Inc

				Most Relevant								Technical							Compliance			Operating Conditions				Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Number of Functions	Number of Bits	Surface Mount	Package Code	Trigger Type	Family	Logic IC Type	Technology	fmax-Min	Output Polarity	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

Yes

Obsolete

2.5 V

2.4 ns

YES

TSSOP

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

R-PDSO-G64

Not Qualified

70 °C

260

PLASTIC/EPOXY

TSSOP64,.32,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Matte Tin (Sn) - annealed

GULL WING

500 µm

DUAL

1.1 mm

6.1 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

GREEN, TSSOP-64

unknown

8542.39.00.01

Check for Price

Transferred

2.5 V

2.2 ns

YES

HVQCCN

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

S-PQCC-N56

Not Qualified

70 °C

PLASTIC/EPOXY

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

1 mm

8 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFN

PLASTIC, VFQFN-56

compliant

8542.39.00.01

Check for Price

Yes

Obsolete

2.5 V

2.2 ns

YES

HVQCCN

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

S-PQCC-N56

Not Qualified

70 °C

260

PLASTIC/EPOXY

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn) - annealed

NO LEAD

500 µm

QUAD

1 mm

8 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFN

GREEN, PLASTIC, VFQFN-56

unknown

8542.39.00.01

Check for Price

Active

2.5 V

2.2 ns

YES

HVQCCN

POSITIVE EDGE

SSTV

D FLIP-FLOP

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

S-PQCC-N56

Not Qualified

70 °C

PLASTIC/EPOXY

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

1 mm

8 mm

RENESAS ELECTRONICS CORP

HVQCCN,

compliant

8542.39.00.01

Check for Price

Active

2.5 V

2.4 ns

YES

TSSOP

POSITIVE EDGE

SSTV

D FLIP-FLOP

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

R-PDSO-G64

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN LEAD

GULL WING

500 µm

DUAL

1.1 mm

6.1 mm

17 mm

RENESAS ELECTRONICS CORP

TSSOP,

compliant

8542.39.00.01

Check for Price

Yes

Obsolete

2.5 V

2.4 ns

YES

TSSOP

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

R-PDSO-G64

Not Qualified

70 °C

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

500 µm

DUAL

1.1 mm

6.1 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

GREEN, TSSOP-64

compliant

8542.39.00.01

Check for Price

Transferred

2.5 V

2.4 ns

YES

TSSOP

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

R-PDSO-G64

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.1 mm

6.1 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

TSSOP-64

compliant

8542.39.00.01

Check for Price

Yes

Obsolete

2.5 V

2.2 ns

YES

HVQCCN

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

S-PQCC-N56

Not Qualified

70 °C

PLASTIC/EPOXY

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

1 mm

8 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFN

GREEN, PLASTIC, VFQFN-56

compliant

8542.39.00.01

Compare

IDT74SSTVN16859CPAG

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

2.5 V

2.4 ns

YES

TSSOP

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

R-PDSO-G64

Not Qualified

70 °C

260

PLASTIC/EPOXY

TSSOP64,.32,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Matte Tin (Sn) - annealed

GULL WING

500 µm

DUAL

1.1 mm

6.1 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

GREEN, TSSOP-64

unknown

8542.39.00.01

IDT74SSTVN16859CNL

Integrated Device Technology Inc

Check for Price

Transferred

2.5 V

2.2 ns

YES

HVQCCN

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

S-PQCC-N56

Not Qualified

70 °C

PLASTIC/EPOXY

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

1 mm

8 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFN

PLASTIC, VFQFN-56

compliant

8542.39.00.01

IDT74SSTVN16859CNLG

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

2.5 V

2.2 ns

YES

HVQCCN

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

S-PQCC-N56

Not Qualified

70 °C

260

PLASTIC/EPOXY

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn) - annealed

NO LEAD

500 µm

QUAD

1 mm

8 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFN

GREEN, PLASTIC, VFQFN-56

unknown

8542.39.00.01

IDT74SSTVN16859CNL

Renesas Electronics Corporation

Check for Price

Active

2.5 V

2.2 ns

YES

HVQCCN

POSITIVE EDGE

SSTV

D FLIP-FLOP

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

S-PQCC-N56

Not Qualified

70 °C

PLASTIC/EPOXY

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

1 mm

8 mm

RENESAS ELECTRONICS CORP

HVQCCN,

compliant

8542.39.00.01

IDT74SSTVN16859CPA

Renesas Electronics Corporation

Check for Price

Active

2.5 V

2.4 ns

YES

TSSOP

POSITIVE EDGE

SSTV

D FLIP-FLOP

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

R-PDSO-G64

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN LEAD

GULL WING

500 µm

DUAL

1.1 mm

6.1 mm

17 mm

RENESAS ELECTRONICS CORP

TSSOP,

compliant

8542.39.00.01

IDT74SSTVN16859CPAG8

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

2.5 V

2.4 ns

YES

TSSOP

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

R-PDSO-G64

Not Qualified

70 °C

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

MATTE TIN

GULL WING

500 µm

DUAL

1.1 mm

6.1 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

GREEN, TSSOP-64

compliant

8542.39.00.01

IDT74SSTVN16859CPA

Integrated Device Technology Inc

Check for Price

Transferred

2.5 V

2.4 ns

YES

TSSOP

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

R-PDSO-G64

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.1 mm

6.1 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

TSSOP-64

compliant

8542.39.00.01

IDT74SSTVN16859CNLG8

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

2.5 V

2.2 ns

YES

HVQCCN

POSITIVE EDGE

SSTV

D FLIP-FLOP

TTL

220 MHz

TRUE

2.7 V

2.3 V

COMMERCIAL

S-PQCC-N56

Not Qualified

70 °C

PLASTIC/EPOXY

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

1 mm

8 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFN

GREEN, PLASTIC, VFQFN-56

compliant

8542.39.00.01

Parametric results for: IDT74SSTVN16859C under FF/Latches