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IDT74SSTVN16859PA
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 2.5 V | 2.7 ns | 1 | 13 | YES | TSSOP | POSITIVE EDGE | SSTV | D FLIP-FLOP | TTL | 220 MHZ FOR PC3200 OPERATION | 200 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | R-PDSO-G64 | Not Qualified | e0 | 1 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | TSSOP64,.32,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin/Lead (Sn85Pb15) | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, TSSOP64,.32,20 | 64 | not_compliant | 8542.39.00.01 | |||
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IDT74SSTVN16859CNL
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 2.5 V | 2.2 ns | 1 | 13 | YES | HVQCCN | POSITIVE EDGE | SSTV | D FLIP-FLOP | TTL | 220 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | S-PQCC-N56 | Not Qualified | e0 | 70 °C | 56 | PLASTIC/EPOXY | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 1 mm | 8 mm | 8 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFN | PLASTIC, VFQFN-56 | 56 | compliant | 8542.39.00.01 | |||||||
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IDT74SSTVN16859PA8
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 2.5 V | 2.7 ns | 1 | 13 | YES | TSSOP | POSITIVE EDGE | SSTV | D FLIP-FLOP | TTL | 220 MHZ FOR PC3200 OPERATION | 200 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | R-PDSO-G64 | Not Qualified | e0 | 1 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | TSSOP64,.32,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin/Lead (Sn85Pb15) | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, TSSOP64,.32,20 | 64 | not_compliant | 8542.39.00.01 | |||
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IDT74SSTVN16859PAG8
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 2.5 V | 2.7 ns | 1 | 13 | YES | TSSOP | POSITIVE EDGE | SSTV | D FLIP-FLOP | TTL | 220 MHZ FOR PC3200 OPERATION | 200 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | R-PDSO-G64 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | TSSOP64,.32,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | GREEN, TSSOP-64 | 64 | unknown | 8542.39.00.01 | |||
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IDT74SSTVN16859NL
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 2.5 V | 2.5 ns | 1 | 13 | YES | VQCCN | POSITIVE EDGE | SSTV | D FLIP-FLOP | TTL | 220 MHZ FOR PC3200 OPERATION | 200 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | S-PQCC-N56 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 56 | PLASTIC/EPOXY | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Tin/Lead (Sn85Pb15) | NO LEAD | 500 µm | QUAD | 1 mm | 8 mm | 8 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFN | VQCCN, LCC56,.31SQ,20 | 56 | not_compliant | 8542.39.00.01 | |||
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IDT74SSTVN16859CPAG
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 2.5 V | 2.4 ns | 1 | 13 | YES | TSSOP | POSITIVE EDGE | SSTV | D FLIP-FLOP | TTL | 220 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | R-PDSO-G64 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | TSSOP64,.32,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | GREEN, TSSOP-64 | 64 | unknown | 8542.39.00.01 | ||||
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IDT74SSTVN16859NLG
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 2.5 V | 2.5 ns | 1 | 13 | YES | VQCCN | POSITIVE EDGE | SSTV | D FLIP-FLOP | TTL | 220 MHZ FOR PC3200 OPERATION | 200 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | S-PQCC-N56 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 1 mm | 8 mm | 8 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFN | GREEN, PLASTIC, VFQFN-56 | 56 | unknown | 8542.39.00.01 | |||
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IDT74SSTVN16859PAG
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 2.5 V | 2.7 ns | 1 | 13 | YES | TSSOP | POSITIVE EDGE | SSTV | D FLIP-FLOP | TTL | 220 MHZ FOR PC3200 OPERATION | 200 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | R-PDSO-G64 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | TSSOP64,.32,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | GREEN, TSSOP-64 | 64 | unknown | 8542.39.00.01 | |||
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IDT74SSTVN16859CNLG
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 2.5 V | 2.2 ns | 1 | 13 | YES | HVQCCN | POSITIVE EDGE | SSTV | D FLIP-FLOP | TTL | 220 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | S-PQCC-N56 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 1 mm | 8 mm | 8 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFN | GREEN, PLASTIC, VFQFN-56 | 56 | unknown | 8542.39.00.01 | ||||
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IDT74SSTVN16859CNL
Renesas Electronics Corporation
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Check for Price | No | Active | 2.5 V | 2.2 ns | 1 | 13 | YES | HVQCCN | POSITIVE EDGE | SSTV | D FLIP-FLOP | 220 MHz | TRUE | 2.7 V | 2.3 V | COMMERCIAL | S-PQCC-N56 | Not Qualified | e0 | 70 °C | 56 | PLASTIC/EPOXY | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 1 mm | 8 mm | 8 mm | RENESAS ELECTRONICS CORP | HVQCCN, | compliant | 8542.39.00.01 |