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IDT72V72100L10BB
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 4.7186 Mbit | 72 | 64KX72 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | RETRANSMIT | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 75 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn63Pb37) | BALL | 1 mm | BOTTOM | 3.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | PLASTIC, FBGA-256 | 256 | not_compliant | EAR99 | 8542.32.00.71 | |||
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IDT72V72100L15BB
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 4.7186 Mbit | 72 | 64KX72 | 3.3 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | RETRANSMIT | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 75 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn63Pb37) | BALL | 1 mm | BOTTOM | 3.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | PLASTIC, FBGA-256 | 256 | not_compliant | EAR99 | 8542.32.00.71 | |||
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IDT72V72100L15BBG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 4.7186 Mbit | 72 | 64KX72 | 3.3 V | 10 ns | 15 ns | OTHER FIFO | RETRANSMIT | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 75 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 70 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 3.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | PLASTIC, FBGA-256 | 256 | compliant | EAR99 | 8542.32.00.71 | |||||||
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IDT72V72100L10BBG
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 4.7186 Mbit | 72 | 64KX72 | 3.3 V | 6.5 ns | 10 ns | OTHER FIFO | RETRANSMIT | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 75 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 3.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | PLASTIC, FBGA-256 | 256 | compliant | EAR99 | 8542.32.00.71 |