Parametric results for: IDT72V2103L7-5BC under FIFOs

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Manufacturer Part Number: idt72v2103l75bc
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IDT72V2103L7.5BCGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 2.3593 Mbit 18 128KX18 3.3 V 5 ns 7.5 ns CAN ALSO BE CONFIGURED AS 262,144 X 9 1 128000 131.072 k SYNCHRONOUS YES PARALLEL 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B100 Not Qualified e1 3 85 °C -40 °C 100 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.5 mm 11 mm 11 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, 100 compliant EAR99 8542.32.00.71
IDT72V2103L7-5BCI
Integrated Device Technology Inc
Check for Price No No Transferred 2.3593 Mbit 18 128KX18 3.3 V 5 ns 133.3 MHz 7.5 ns OTHER FIFO 9 1 128000 131.072 k SYNCHRONOUS/ASYNCHRONOUS YES PARALLEL 15 mA 35 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B100 Not Qualified e0 3 85 °C -40 °C 225 30 100 PLASTIC/EPOXY BGA BGA100,10X10,40 SQUARE GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, BGA100,10X10,40 not_compliant EAR99 8542.32.00.71 1998-11-01
IDT72V2103L7.5BCG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 2.3593 Mbit 18 128KX18 3.3 V 5 ns 7.5 ns CAN ALSO BE CONFIGURED AS 262,144 X 9 1 128000 131.072 k SYNCHRONOUS YES PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B100 Not Qualified e1 3 70 °C 100 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.5 mm 11 mm 11 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, 100 compliant EAR99 8542.32.00.71
IDT72V2103L7-5BC
Integrated Device Technology Inc
Check for Price No No Transferred 2.3593 Mbit 18 128KX18 3.3 V 5 ns 133.3 MHz 7.5 ns OTHER FIFO ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE 9 1 128000 131.072 k SYNCHRONOUS YES PARALLEL 15 mA 35 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B100 Not Qualified e0 3 70 °C 225 30 100 PLASTIC/EPOXY LBGA BGA100,10X10,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 11 mm 11 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA100,10X10,40 100 not_compliant EAR99 8542.32.00.71 1998-11-01
IDT72V2103L7-5BCG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 2.3593 Mbit 18 128KX18 3.3 V 5 ns 133.3 MHz 7.5 ns OTHER FIFO ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE 9 1 128000 131.072 k SYNCHRONOUS YES PARALLEL 15 mA 35 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B100 Not Qualified e1 3 70 °C 260 30 100 PLASTIC/EPOXY LBGA BGA100,10X10,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.5 mm 11 mm 11 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA100,10X10,40 100 compliant EAR99 8542.32.00.71
IDT72V2103L7.5BC
Integrated Device Technology Inc
Check for Price No Obsolete 2.3593 Mbit 18 128KX18 3.3 V 10 ns 83 MHz OTHER FIFO 9 128000 131.072 k SYNCHRONOUS/ASYNCHRONOUS 15 mA 35 µA CMOS COMMERCIAL S-PBGA-B100 Not Qualified e0 3 70 °C 225 30 100 PLASTIC/EPOXY BGA BGA100,10X10,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant EAR99 8542.32.00.71
IDT72V2103L7-5BCGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 2.3593 Mbit 18 128KX18 3.3 V 5 ns 133.3 MHz 7.5 ns OTHER FIFO ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE 9 1 128000 131.072 k SYNCHRONOUS YES PARALLEL 15 mA 35 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B100 Not Qualified e1 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LBGA BGA100,10X10,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.5 mm 11 mm 11 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA100,10X10,40 100 compliant EAR99 8542.32.00.71