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Parametric results for: IDT72T6480L10BB under Other uPs/uCs/Peripheral ICs

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Manufacturer Part Number: idt72t6480l10bb

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Select Parts		Part Number

		IDT72T6480L10BBI Integrated Device Technology Inc
		IDT72T6480L10BB Integrated Device Technology Inc

			Most Relevant			Technical					Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

No

Obsolete

YES

2.5 V

MICROPROCESSOR CIRCUIT

CMOS

650 mA

2.625 V

2.375 V

INDUSTRIAL

S-PBGA-B324

Not Qualified

e0

3

85 °C

-40 °C

225

30

324

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

GRID ARRAY

Tin/Lead (Sn63Pb37)

BALL

1 mm

BOTTOM

1.72 mm

19 mm

19 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324

324

not_compliant

8542.31.00.01

Check for Price

No

Obsolete

YES

2.5 V

MICROPROCESSOR CIRCUIT

CMOS

650 mA

2.625 V

2.375 V

INDUSTRIAL

S-PBGA-B324

Not Qualified

e0

3

85 °C

-40 °C

225

30

324

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

GRID ARRAY

Tin/Lead (Sn63Pb37)

BALL

1 mm

BOTTOM

1.72 mm

19 mm

19 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324

324

not_compliant

8542.31.00.01

Compare

Microcontrollers and Processors

IDT72T6480L10BBI

Integrated Device Technology Inc

Check for Price

No

Obsolete

YES

2.5 V

MICROPROCESSOR CIRCUIT

CMOS

650 mA

2.625 V

2.375 V

INDUSTRIAL

S-PBGA-B324

Not Qualified

e0

3

85 °C

-40 °C

225

30

324

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

GRID ARRAY

Tin/Lead (Sn63Pb37)

BALL

1 mm

BOTTOM

1.72 mm

19 mm

19 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324

324

not_compliant

8542.31.00.01

Microcontrollers and Processors

IDT72T6480L10BB

Integrated Device Technology Inc

Check for Price

No

Obsolete

YES

2.5 V

MICROPROCESSOR CIRCUIT

CMOS

650 mA

2.625 V

2.375 V

INDUSTRIAL

S-PBGA-B324

Not Qualified

e0

3

85 °C

-40 °C

225

30

324

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

GRID ARRAY

Tin/Lead (Sn63Pb37)

BALL

1 mm

BOTTOM

1.72 mm

19 mm

19 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324

324

not_compliant

8542.31.00.01