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IDT72T1885L6-7BBG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 589.824 kbit | 18 | 32KX18 | 2.5 V | 3.8 ns | 66 MHz | 6.7 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 50 mA | 60 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B144 | Not Qualified | e1 | 3 | 70 °C | 144 | PLASTIC/EPOXY | BGA | BGA144,12X12,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 13 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA144,12X12,40 | 144 | compliant | EAR99 | 8542.32.00.71 | |||||
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IDT72T1885L6-7BBI
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 589.824 kbit | 18 | 32KX18 | 2.5 V | 12 ns | 66 MHz | OTHER FIFO | 9 | 32000 | 32.768 k | SYNCHRONOUS/ASYNCHRONOUS | 50 mA | 60 µA | CMOS | INDUSTRIAL | S-PBGA-B144 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 144 | PLASTIC/EPOXY | BGA | BGA144,12X12,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||
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IDT72T1885L6-7BB
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 589.824 kbit | 18 | 32KX18 | 2.5 V | 3.8 ns | 66 MHz | 6.7 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 32000 | 32.768 k | SYNCHRONOUS | YES | PARALLEL | 50 mA | 60 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B144 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 144 | PLASTIC/EPOXY | BGA | BGA144,12X12,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 13 mm | 13 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 | 144 | not_compliant | EAR99 | 8542.32.00.71 |