Parametric results for: IDT72T1885L6BBI under FIFOs

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Manufacturer Part Number: idt72t1885l6
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IDT72T1885L6-7BBG
Integrated Device Technology Inc
Check for Price Yes Yes Obsolete 589.824 kbit 18 32KX18 2.5 V 3.8 ns 66 MHz 6.7 ns OTHER FIFO ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE 9 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 50 mA 60 µA 2.625 V 2.375 V CMOS COMMERCIAL S-PBGA-B144 Not Qualified e1 3 70 °C 144 PLASTIC/EPOXY BGA BGA144,12X12,40 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.97 mm 13 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA144,12X12,40 144 compliant EAR99 8542.32.00.71
IDT72T1885L6-7BBI
Integrated Device Technology Inc
Check for Price No Obsolete 589.824 kbit 18 32KX18 2.5 V 12 ns 66 MHz OTHER FIFO 9 32000 32.768 k SYNCHRONOUS/ASYNCHRONOUS 50 mA 60 µA CMOS INDUSTRIAL S-PBGA-B144 Not Qualified e0 3 85 °C -40 °C 225 30 144 PLASTIC/EPOXY BGA BGA144,12X12,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant EAR99 8542.32.00.71
IDT72T1885L6-7BB
Integrated Device Technology Inc
Check for Price No No Obsolete 589.824 kbit 18 32KX18 2.5 V 3.8 ns 66 MHz 6.7 ns OTHER FIFO ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE 9 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 50 mA 60 µA 2.625 V 2.375 V CMOS COMMERCIAL S-PBGA-B144 Not Qualified e0 3 70 °C 225 30 144 PLASTIC/EPOXY BGA BGA144,12X12,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM 1.97 mm 13 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 144 not_compliant EAR99 8542.32.00.71