Filter Your Search
1 - 10 of 15 results
|
IDT72T18105L39240BB
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 3.8 ns | 6.7 ns | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B240 | Not Qualified | e0 | 3 | 70 °C | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 | 240 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
|
IDT72T18105L4-4BBG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 3.4 ns | 100 MHz | 4.44 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 60 mA | 70 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B240 | Not Qualified | e1 | 3 | 70 °C | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA240,18X18,40 | 240 | compliant | EAR99 | 8542.32.00.71 | |||||
|
IDT72T18105L10BBI
Integrated Device Technology Inc
|
Check for Price | No | Obsolete | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 14 ns | 50 MHz | OTHER FIFO | 9 | 128000 | 131.072 k | SYNCHRONOUS/ASYNCHRONOUS | 50 mA | 60 µA | CMOS | INDUSTRIAL | S-PBGA-B240 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||
|
IDT72T18105L10BBG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 4.5 ns | 50 MHz | 10 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 60 mA | 70 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B240 | Not Qualified | e1 | 3 | 70 °C | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA240,18X18,40 | 240 | compliant | EAR99 | 8542.32.00.71 | |||||
|
IDT72T18105L5BBI
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 3.6 ns | 83 MHz | 5 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 70 µA | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | S-PBGA-B240 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA240,18X18,40 | 240 | not_compliant | EAR99 | 8542.32.00.71 | ||
|
IDT72T18105L6-7BBG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 3.8 ns | 66 MHz | 6.7 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 60 mA | 70 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B240 | Not Qualified | e1 | 3 | 70 °C | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA240,18X18,40 | 240 | compliant | EAR99 | 8542.32.00.71 | |||||
|
IDT72T18105L5BBG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 3.6 ns | 83 MHz | 5 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 60 mA | 70 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B240 | Not Qualified | e1 | 3 | 70 °C | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA240,18X18,40 | 240 | compliant | EAR99 | 8542.32.00.71 | |||||
|
IDT72T18105L6-7BBI
Integrated Device Technology Inc
|
Check for Price | No | Obsolete | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 12 ns | 66 MHz | OTHER FIFO | 9 | 128000 | 131.072 k | SYNCHRONOUS/ASYNCHRONOUS | 50 mA | 60 µA | CMOS | INDUSTRIAL | S-PBGA-B240 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||
|
IDT72T18105L5BBGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 3.6 ns | 83 MHz | 5 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 60 mA | 70 µA | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | S-PBGA-B240 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA240,18X18,40 | 240 | compliant | EAR99 | 8542.32.00.71 | ||||
|
IDT72T18105L6-7BB
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 2.3593 Mbit | 18 | 128KX18 | 2.5 V | 3.8 ns | 66 MHz | 6.7 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | 9 | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 70 µA | 2.625 V | 2.375 V | CMOS | COMMERCIAL | S-PBGA-B240 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | BGA240,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA240,18X18,40 | 240 | not_compliant | EAR99 | 8542.32.00.71 |