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IDT7282L12J
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 4.608 kbit | 9 | 512X9 | 5 V | 65 ns | 80 ns | OTHER FIFO | 1 | 512 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 35 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, | 32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||
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IDT7282L12SO
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 4.608 kbit | 9 | 512X9 | 5 V | 65 ns | 80 ns | OTHER FIFO | 1 | 512 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 35 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3.048 mm | 18.3642 mm | 8.763 mm | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | SOP, | 28 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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IDT7282L12TD
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 36.864 kbit | 9 | 4KX9 | 5 V | 65 ns | 80 ns | OTHER FIFO | 1 | 4000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 35 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDIP-T28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 37.1475 mm | 7.62 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, | 28 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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IDT7282L12TP
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 18.432 kbit | 9 | 2KX9 | 5 V | 65 ns | 80 ns | OTHER FIFO | 1 | 2000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 65 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.572 mm | 34.671 mm | 7.62 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, | 28 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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IDT7282L12PA8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 9.216 kbit | 9 | 1KX9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 125 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e0 | 1 | 70 °C | 240 | 20 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Tin/Lead (Sn85Pb15) | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, TSSOP56,.3,20 | 56 | not_compliant | EAR99 | 8542.32.00.71 | ||||
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IDT7282L12PA
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 9.216 kbit | 9 | 1KX9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 125 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e0 | 1 | 70 °C | 240 | 20 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Tin/Lead (Sn85Pb15) | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, TSSOP56,.3,20 | 56 | not_compliant | EAR99 | 8542.32.00.71 | ||||
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IDT7282L12PAG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 15 mA | 125 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, TSSOP56,.3,20 | 56 | compliant | EAR99 | 8542.32.00.71 | 1996-03-01 | ||
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IDT7282L12PAG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 2 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 15 mA | 125 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.2 mm | 14 mm | 6.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, TSSOP56,.3,20 | 56 | compliant | EAR99 | 8542.32.00.71 | 1996-03-01 |