Parametric results for: IDT72251L25JG under FIFOs

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Manufacturer Part Number: idt72251l25jg
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IDT72251L25JG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 73.728 kbit 9 8KX9 5 V 15 ns 40 MHz 25 ns OTHER FIFO 1 8000 8.192 k SYNCHRONOUS YES PARALLEL 5 mA 50 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.5 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71
IDT72251L25JGI8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 73.728 kbit 9 8KX9 5 V 15 ns 25 ns 1 8000 8.192 k SYNCHRONOUS YES PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
IDT72251L25JGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 73.728 kbit 9 8KX9 5 V 15 ns 40 MHz 25 ns OTHER FIFO 1 8000 8.192 k SYNCHRONOUS YES PARALLEL 5 mA 50 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.5 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71
IDT72251L25JG8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 73.728 kbit 9 8KX9 5 V 15 ns 25 ns 1 8000 8.192 k SYNCHRONOUS YES PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 70 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71