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IDT7200L12JG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 2.304 kbit | 9 | 256X9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 256 | 256 words | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, LDCC32,.5X.6 | 32 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | ||
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IDT7200L12JG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 2.304 kbit | 9 | 256X9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 256 | 256 words | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, LDCC32,.5X.6 | 32 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 |