Findchips: Parametric Search Results for IDT71V65603S150BQ


Select Parts		Part Number

		IDT71V65603S150BQGI Integrated Device Technology Inc
		IDT71V65603S150BQ8 Integrated Device Technology Inc
		IDT71V65603S150BQI Integrated Device Technology Inc
		IDT71V65603S150BQI8 Integrated Device Technology Inc
		IDT71V65603S150BQ Integrated Device Technology Inc
		IDT71V65603S150BQG Integrated Device Technology Inc

				Most Relevant					Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price Buy

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

345 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price Buy

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price Buy

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

345 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price Buy

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price Buy

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

BURST COUNTER

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

325 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price Buy

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

BURST COUNTER

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

325 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT71V65603S150BQGI

Integrated Device Technology Inc

Check for Price Buy

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

345 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603S150BQ8

Integrated Device Technology Inc

Check for Price Buy

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603S150BQI

Integrated Device Technology Inc

Check for Price Buy

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

345 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603S150BQI8

Integrated Device Technology Inc

Check for Price Buy

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603S150BQ

Integrated Device Technology Inc

Check for Price Buy

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

BURST COUNTER

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

325 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603S150BQG

Integrated Device Technology Inc

Check for Price Buy

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

BURST COUNTER

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

325 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: IDT71V65603S150BQ under SRAMs