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Manufacturer Part Number: idt70v7519s133b
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IDT70V7519S133BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 645 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V7519S133BFI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 675 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V7519S133BF8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 645 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V7519S133BC
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 645 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V7519S133BFGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 208 PLASTIC/EPOXY TFBGA SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70V7519S133BC8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 645 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V7519S133BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 208 PLASTIC/EPOXY TFBGA SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70V7519S133BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 208 PLASTIC/EPOXY TFBGA SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70V7519S133BCG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, 256 compliant 3A991.B.2.A 8542.32.00.41
IDT70V7519S133BFI
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 36 256KX36 3.3 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 675 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
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