Findchips: Parametric Search Results for IDT70V7339S133BCG


Select Parts		Part Number

		IDT70V7339S133BCG8 Integrated Device Technology Inc
		IDT70V7339S133BCG Integrated Device Technology Inc
		IDT70V7339S133BCGI Integrated Device Technology Inc
		IDT70V7339S133BCGI8 Integrated Device Technology Inc

				Most Relevant					Technical											Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

9.4372 Mbit

512KX18

3.3 V

15 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

512000

524.288 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA,

256

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

512KX18

3.3 V

15 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

512000

524.288 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA,

256

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

512KX18

3.3 V

15 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

512000

524.288 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA,

256

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

512KX18

3.3 V

15 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

512000

524.288 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA,

256

compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT70V7339S133BCG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

512KX18

3.3 V

15 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

512000

524.288 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA,

256

compliant

3A991.B.2.A

8542.32.00.41

IDT70V7339S133BCG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

512KX18

3.3 V

15 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

512000

524.288 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA,

256

compliant

3A991.B.2.A

8542.32.00.41

IDT70V7339S133BCGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

512KX18

3.3 V

15 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

512000

524.288 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA,

256

compliant

3A991.B.2.A

8542.32.00.41

IDT70V7339S133BCGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

512KX18

3.3 V

15 ns

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

512000

524.288 k

SYNCHRONOUS

PARALLEL

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

256

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA,

256

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: IDT70V7339S133BCG under SRAMs