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IDT70V657S15BCG
Integrated Device Technology Inc
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Check for Price Buy | Yes | Yes | Transferred | 1.1796 Mbit | 36 | 32KX36 | 3.3 V | 15 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 440 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA256,16X16,40 | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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IDT70V657S15BCGI
Integrated Device Technology Inc
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Check for Price Buy | Yes | Yes | Transferred | 1.1796 Mbit | 36 | 32KX36 | 3.3 V | 15 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 490 µA | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA256,16X16,40 | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||
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IDT70V657S15BCG8
Integrated Device Technology Inc
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Check for Price Buy | Yes | Yes | Transferred | 1.1796 Mbit | 36 | 32KX36 | 3.3 V | 15 ns | MULTI-PORT SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B256 | Not Qualified | e1 | 3 | 70 °C | 256 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.5 mm | 17 mm | 17 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, | 256 | compliant | 3A991.B.2.A | 8542.32.00.41 |