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Manufacturer Part Number: idt70v3569s
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IDT70V3569S4BF8
 Integrated Device Technology Inc 		Check for Price No No Transferred 589.824 kbit 36 16KX36 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 460 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.B 8542.32.00.41 1999-01-01
IDT70V3569S6BCI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 589.824 kbit 36 16KX36 3.3 V 6 ns 83 MHz MULTI-PORT SRAM COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA208,17X17,32 256 not_compliant 3A991.B.2.B 8542.32.00.41
IDT70V3569S4DR8
 Integrated Device Technology Inc 		Check for Price No No Transferred 589.824 kbit 36 16KX36 3.3 V 4.2 ns MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PQFP-G208 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 208 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, QFP-208 208 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3569S6DRG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 36 16KX36 3.3 V 6 ns 83 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 310 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PQFP-G208 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 208 PLASTIC/EPOXY FQFP QFP208,1.2SQ,20 SQUARE FLATPACK, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC QFP FQFP, QFP208,1.2SQ,20 208 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3569S5BFI
 Integrated Device Technology Inc 		Check for Price No No Transferred 589.824 kbit 36 16KX36 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 415 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.B 8542.32.00.41 1999-01-01
IDT70V3569S4DR
 Integrated Device Technology Inc 		Check for Price No No Obsolete 589.824 kbit 36 16KX36 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 460 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PQFP-G208 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 208 PLASTIC/EPOXY FQFP QFP208,1.2SQ,20 SQUARE FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC QFP FQFP, QFP208,1.2SQ,20 208 not_compliant 3A991.B.2.B 8542.32.00.41
IDT70V3569S5DRG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 36 16KX36 3.3 V 5 ns MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PQFP-G208 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 208 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC QFP FQFP, 208 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3569S6DRGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 36 16KX36 3.3 V 6 ns MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS INDUSTRIAL S-PQFP-G208 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 208 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC QFP FQFP, 208 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3569S5BCG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 36 16KX36 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS COMMERCIAL S-CBGA-B256 Not Qualified e1 3 70 °C 260 30 256 CERAMIC, METAL-SEALED COFIRED LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3569S5DR8
 Integrated Device Technology Inc 		Check for Price No No Transferred 589.824 kbit 36 16KX36 3.3 V 5 ns MULTI-PORT SRAM PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PQFP-G208 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 208 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 4.1 mm 28 mm 28 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, QFP-208 208 compliant 3A991.B.2.B 8542.32.00.41
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