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Manufacturer Part Number: idt70v3379s
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IDT70V3379S6BC8
 Integrated Device Technology Inc 		Check for Price No No Transferred 589.824 kbit 18 32KX18 3.3 V 6 ns 83 MHz MULTI-PORT SRAM COMMON 1 2 32000 32.768 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 310 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.B 8542.32.00.41 1999-01-01
IDT70V3379S6BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 589.824 kbit 18 32KX18 3.3 V 6 ns 83 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE COMMON 1 2 32000 32.768 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 310 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.B 8542.32.00.41 1999-01-01
IDT70V3379S5PRFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 18 32KX18 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE COMMON 1 2 32000 32.768 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS COMMERCIAL R-PQFP-G128 Not Qualified e3 3 70 °C 260 30 128 PLASTIC/EPOXY LFQFP QFP128,.63X.87,20 RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) - annealed GULL WING 500 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LFQFP, QFP128,.63X.87,20 128 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3379S4PRF
 Integrated Device Technology Inc 		Check for Price No No Obsolete 589.824 kbit 18 32KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE COMMON 1 2 32000 32.768 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 460 µA 3.45 V 3.15 V CMOS COMMERCIAL R-PQFP-G128 Not Qualified e0 3 70 °C 225 30 128 PLASTIC/EPOXY LFQFP QFP128,.63X.87,20 RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn85Pb15) GULL WING 500 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-128 128 not_compliant 3A991.B.2.B 8542.32.00.41
IDT70V3379S4PRF9
 Integrated Device Technology Inc 		Check for Price No No Obsolete 589.824 kbit 18 32KX18 3.3 V 4.2 ns MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE 1 32000 32.768 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL R-PQFP-G128 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 128 PLASTIC/EPOXY LFQFP RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-128 128 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3379S4BCG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 18 32KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM COMMON 1 2 32000 32.768 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 460 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3379S5PRFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 18 32KX18 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE COMMON 1 2 32000 32.768 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS COMMERCIAL R-PQFP-G128 Not Qualified e3 3 70 °C 260 30 128 PLASTIC/EPOXY LFQFP QFP128,.63X.87,20 RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) - annealed GULL WING 500 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LFQFP, QFP128,.63X.87,20 128 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3379S4BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 18 32KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE COMMON 1 2 32000 32.768 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 460 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3379S6BCG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 589.824 kbit 18 32KX18 3.3 V 6 ns 83 MHz MULTI-PORT SRAM COMMON 1 2 32000 32.768 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 310 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.B 8542.32.00.41
IDT70V3379S5PRF9
 Integrated Device Technology Inc 		Check for Price No No Obsolete 589.824 kbit 18 32KX18 3.3 V 5 ns MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE 1 32000 32.768 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL R-PQFP-G128 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 128 PLASTIC/EPOXY LFQFP RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-128 128 compliant 3A991.B.2.B 8542.32.00.41
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