Findchips: Parametric Search Results for IDT70V07L

Parametric results for: IDT70V07L under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		IDT70V07L25PF Integrated Device Technology Inc
		IDT70V07L25JGI8 Integrated Device Technology Inc
		IDT70V07L35J Integrated Device Technology Inc
		IDT70V07L25JI Integrated Device Technology Inc
		IDT70V07L25JI8 Integrated Device Technology Inc
		IDT70V07L25PFG Integrated Device Technology Inc
		IDT70V07L55GG Integrated Device Technology Inc
		IDT70V07L25GGI Integrated Device Technology Inc
		IDT70V07L25PFI Integrated Device Technology Inc
		IDT70V07L55J8 Integrated Device Technology Inc

				Most Relevant					Technical																		Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3 mA

3 V

140 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G80

Not Qualified

70 °C

240

PLASTIC/EPOXY

LQFP

QFP80,.64SQ

SQUARE

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-80

not_compliant

EAR99

8542.32.00.41

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQCC-J68

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

QCCJ,

compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

35 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3 mA

3 V

120 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

225

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 mA

3 V

185 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQCC-J68

Not Qualified

85 °C

-40 °C

225

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 mA

3 V

185 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQCC-J68

Not Qualified

85 °C

-40 °C

225

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

PLASTIC, LCC-68

not_compliant

EAR99

8542.32.00.41

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G80

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

compliant

EAR99

8542.32.00.41

1995-01-01

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

55 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-CPGA-P68

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

MATTE TIN

PIN/PEG

2.54 mm

PERPENDICULAR

5.207 mm

29.464 mm

INTEGRATED DEVICE TECHNOLOGY INC

PGA

PGA,

compliant

EAR99

8542.32.00.41

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-CPGA-P68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

MATTE TIN

PIN/PEG

2.54 mm

PERPENDICULAR

5.207 mm

29.464 mm

INTEGRATED DEVICE TECHNOLOGY INC

PGA

PGA,

compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 mA

3 V

185 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQFP-G80

Not Qualified

85 °C

-40 °C

240

PLASTIC/EPOXY

LQFP

QFP80,.64SQ

SQUARE

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-80

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

55 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3 mA

3 V

120 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

225

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

not_compliant

EAR99

8542.32.00.41

1 2 3 4 5 Next

Compare

IDT70V07L25PF

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3 mA

3 V

140 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G80

Not Qualified

70 °C

240

PLASTIC/EPOXY

LQFP

QFP80,.64SQ

SQUARE

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-80

not_compliant

EAR99

8542.32.00.41

IDT70V07L25JGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQCC-J68

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

QCCJ,

compliant

EAR99

8542.32.00.41

IDT70V07L35J

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

35 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3 mA

3 V

120 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

225

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

not_compliant

EAR99

8542.32.00.41

IDT70V07L25JI

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 mA

3 V

185 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQCC-J68

Not Qualified

85 °C

-40 °C

225

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

not_compliant

EAR99

8542.32.00.41

IDT70V07L25JI8

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 mA

3 V

185 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQCC-J68

Not Qualified

85 °C

-40 °C

225

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

PLASTIC, LCC-68

not_compliant

EAR99

8542.32.00.41

IDT70V07L25PFG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQFP-G80

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

compliant

EAR99

8542.32.00.41

1995-01-01

IDT70V07L55GG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

55 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-CPGA-P68

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

MATTE TIN

PIN/PEG

2.54 mm

PERPENDICULAR

5.207 mm

29.464 mm

INTEGRATED DEVICE TECHNOLOGY INC

PGA

PGA,

compliant

EAR99

8542.32.00.41

IDT70V07L25GGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-CPGA-P68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

MATTE TIN

PIN/PEG

2.54 mm

PERPENDICULAR

5.207 mm

29.464 mm

INTEGRATED DEVICE TECHNOLOGY INC

PGA

PGA,

compliant

EAR99

8542.32.00.41

IDT70V07L25PFI

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

3 mA

3 V

185 µA

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQFP-G80

Not Qualified

85 °C

-40 °C

240

PLASTIC/EPOXY

LQFP

QFP80,.64SQ

SQUARE

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 14 MM, 1.40 MM HEIGHT, TQFP-80

not_compliant

EAR99

8542.32.00.41

IDT70V07L55J8

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

3.3 V

55 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3 mA

3 V

120 µA

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

225

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

not_compliant

EAR99

8542.32.00.41

1 2 3 4 5 Next