Findchips: Parametric Search Results for IDT6116LA

Parametric results for: IDT6116LA under SRAMs

Select parts from the table below to compare.

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Select Parts		Part Number

		IDT6116LA45L328 Integrated Device Technology Inc
		IDT6116LA150DM Integrated Device Technology Inc
		IDT6116LA45L32B Integrated Device Technology Inc
		IDT6116LA55D Integrated Device Technology Inc
		IDT6116LA35SO8 Integrated Device Technology Inc
		IDT6116LA150FB Integrated Device Technology Inc
		IDT6116LA30F Integrated Device Technology Inc
		IDT6116LA15TD Integrated Device Technology Inc
		IDT6116LA120DB Integrated Device Technology Inc
		IDT6116LA15L28 Integrated Device Technology Inc

				Most Relevant					Technical																	Compliance			Operating Conditions						Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

45 ns

STANDARD SRAM

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

QCCN,

unknown

EAR99

8542.32.00.41

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

150 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

200 µA

2 V

CMOS

MILITARY

R-XDIP-T24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

45 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

95 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

LCC-32

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

55 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

20 µA

2 V

80 µA

CMOS

COMMERCIAL

R-XDIP-T24

Not Qualified

70 °C

CERAMIC

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

unknown

EAR99

8542.32.00.41

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

35 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

20 µA

2 V

95 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G24

Not Qualified

70 °C

225

PLASTIC/EPOXY

SOP

SOP24,.4

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

2.65 mm

15.4 mm

7.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

SOIC

0.300 INCH, SOIC-24

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

150 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

85 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDFP-F24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

DFP

FL24,.4

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.9 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

FP-24

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

29 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

20 µA

2 V

105 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDFP-F24

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

DFP

FL24,.4

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.9 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

FP-24

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

15 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

20 µA

2 V

140 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T24

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

32.004 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, CERDIP-24

not_compliant

EAR99

8542.32.00.41

Check for Price

Transferred

16.384 kbit

2KX8

5 V

120 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

85 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

225

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

4.826 mm

32.004 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP, DIP24,.6

not_compliant

3A001.A.2.C

8542.32.00.41

1986-09-17

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

15 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

20 µA

2 V

140 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CQCC-N28

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC28,.45SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

2.54 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

LCC-28

not_compliant

EAR99

8542.32.00.41

1 2 3 4 5 Next

Compare

IDT6116LA45L328

Integrated Device Technology Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

45 ns

STANDARD SRAM

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

QCCN,

unknown

EAR99

8542.32.00.41

IDT6116LA150DM

Integrated Device Technology Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

150 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

200 µA

2 V

CMOS

MILITARY

R-XDIP-T24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

not_compliant

3A001.A.2.C

8542.32.00.41

IDT6116LA45L32B

Integrated Device Technology Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

45 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

95 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

LCC-32

not_compliant

3A001.A.2.C

8542.32.00.41

IDT6116LA55D

Integrated Device Technology Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

55 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

20 µA

2 V

80 µA

CMOS

COMMERCIAL

R-XDIP-T24

Not Qualified

70 °C

CERAMIC

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

INTEGRATED DEVICE TECHNOLOGY INC

unknown

EAR99

8542.32.00.41

IDT6116LA35SO8

Integrated Device Technology Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

35 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

20 µA

2 V

95 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G24

Not Qualified

70 °C

225

PLASTIC/EPOXY

SOP

SOP24,.4

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

2.65 mm

15.4 mm

7.5 mm

INTEGRATED DEVICE TECHNOLOGY INC

SOIC

0.300 INCH, SOIC-24

not_compliant

EAR99

8542.32.00.41

IDT6116LA150FB

Integrated Device Technology Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

150 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

85 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDFP-F24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

DFP

FL24,.4

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.9 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

FP-24

not_compliant

3A001.A.2.C

8542.32.00.41

IDT6116LA30F

Integrated Device Technology Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

29 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

20 µA

2 V

105 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDFP-F24

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

DFP

FL24,.4

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.286 mm

9.9 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

FP-24

not_compliant

EAR99

8542.32.00.41

IDT6116LA15TD

Integrated Device Technology Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

15 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

20 µA

2 V

140 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T24

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

32.004 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, CERDIP-24

not_compliant

EAR99

8542.32.00.41

IDT6116LA120DB

Integrated Device Technology Inc

Check for Price

Transferred

16.384 kbit

2KX8

5 V

120 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

85 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

225

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

4.826 mm

32.004 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP, DIP24,.6

not_compliant

3A001.A.2.C

8542.32.00.41

1986-09-17

IDT6116LA15L28

Integrated Device Technology Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

15 ns

STANDARD SRAM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

20 µA

2 V

140 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CQCC-N28

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC28,.45SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

2.54 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

LCC-28

not_compliant

EAR99

8542.32.00.41

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