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HYB18T256400AC-5
Infineon Technologies AG
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Check for Price | No | Transferred | 268.4355 Mbit | 4 | 64MX4 | 1.8 V | 600 ps | FOUR BANK PAGE BURST | DDR DRAM | AUTO/SELF REFRESH | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B60 | Not Qualified | 95 °C | NOT SPECIFIED | NOT SPECIFIED | 60 | PLASTIC/EPOXY | FBGA | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 10.5 mm | 10 mm | INFINEON TECHNOLOGIES AG | DSBGA | FBGA, | 60 | compliant | EAR99 | 8542.32.00.24 | |||||||||||||
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HYB18T256400AC-5
Qimonda AG
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Check for Price | No | Obsolete | 268.4355 Mbit | 4 | 64MX4 | 1.8 V | 600 ps | 200 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 4.5 mA | 125 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B60 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 60 | PLASTIC/EPOXY | TFBGA | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 10.5 mm | 10 mm | QIMONDA AG | BGA | TFBGA, BGA60,9X11,32 | 60 | unknown | EAR99 | 8542.32.00.24 |