Findchips: Parametric Search Results for HV758FB-G


Select Parts		Part Number

		HV758FB-G Supertex Inc
		HV758FB-G Microchip Technology Inc

				Most Relevant	Technical							Compliance			Operating Conditions				Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Interface IC Type	Technology	Number of Functions	Supply Voltage-Max	Supply Voltage-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

Yes

Transferred

12 V

INTERFACE CIRCUIT

CMOS

12.6 V

7.5 V

YES

AUTOMOTIVE

S-PBGA-B64

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

MATTE TIN

BALL

800 µm

BOTTOM

8 mm

2.45 mm

8 mm

SUPERTEX INC

BGA

FBGA,

compliant

8542.39.00.01

Check for Price

Active

12 V

INTERFACE CIRCUIT

CMOS

12.6 V

7.5 V

YES

AUTOMOTIVE

S-PBGA-B64

Not Qualified

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

MATTE TIN

BALL

800 µm

BOTTOM

8 mm

2.45 mm

8 mm

MICROCHIP TECHNOLOGY INC

8 X 8 MM, 2.45 MM HEIGHT, 0.80 MM PITCH, GREEN, FCBGA-64

compliant

8542.39.00.01

Compare

HV758FB-G

Supertex Inc

Check for Price

Yes

Transferred

12 V

INTERFACE CIRCUIT

CMOS

12.6 V

7.5 V

YES

AUTOMOTIVE

S-PBGA-B64

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

MATTE TIN

BALL

800 µm

BOTTOM

8 mm

2.45 mm

8 mm

SUPERTEX INC

BGA

FBGA,

compliant

8542.39.00.01

HV758FB-G

Microchip Technology Inc

Check for Price

Active

12 V

INTERFACE CIRCUIT

CMOS

12.6 V

7.5 V

YES

AUTOMOTIVE

S-PBGA-B64

Not Qualified

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

MATTE TIN

BALL

800 µm

BOTTOM

8 mm

2.45 mm

8 mm

MICROCHIP TECHNOLOGY INC

8 X 8 MM, 2.45 MM HEIGHT, 0.80 MM PITCH, GREEN, FCBGA-64

compliant

8542.39.00.01

Parametric results for: HV758FB-G under Other Interface ICs