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HV2601FG-G
Supertex Inc
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$12.3495 | Yes | Yes | Transferred | 3.3 V | YES | 38 Ω | 5 Ω | 5 µs | 5 µs | SPST | CMOS | ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY | 1 | 1 | 33 dB | 5.5 V | 3 V | COMMERCIAL | S-PQFP-G48 | Not Qualified | e3 | 3 | 70 °C | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.6 mm | 7 mm | SUPERTEX INC | QFP | LFQFP, QFP48,.35SQ,20 | 48 | compliant | 8542.39.00.01 | |||||||||||
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HV2601FG-G
Microchip Technology Inc
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$16.8595 | Yes | Active | 5 V | YES | 38 Ω | 1.9 Ω | 5 µs | 5 µs | SINGLE-ENDED MULTIPLEXER | CMOS | ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY | 30 V | -30 V | NO | 16 | 1 | 33 dB | 4 mA | 5.5 V | 3 V | COMMERCIAL | S-PQFP-G48 | Not Qualified | e3 | 70 °C | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.6 mm | 7 mm | MICROCHIP TECHNOLOGY INC | compliant | 8541.29.00.95 | EAR99 | Microchip | ||||||||||
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HV2601TQ-G-M931
Microchip Technology Inc
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$17.5300 | Yes | Active | 5 V | YES | 38 Ω | 1.3 Ω | 5 µs | 5 µs | SINGLE-ENDED MULTIPLEXER | CMOS | NO | 16 | 1 | 33 dB | SEPARATE OUTPUT | 4 mA | 5.5 V | 3 V | S-PQFP-G48 | e3 | 3 | 70 °C | 260 | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MICROCHIP TECHNOLOGY INC | TQFP-48 | compliant | ||||||||||||||
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HV2601FG-G-M931
Microchip Technology Inc
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$19.8379 | Yes | Active | 5 V | YES | 38 Ω | 1.3 Ω | 5 µs | 5 µs | SINGLE-ENDED MULTIPLEXER | CMOS | NO | 16 | 1 | 33 dB | SEPARATE OUTPUT | 4 mA | 5.5 V | 3 V | S-PQFP-G48 | e3 | 70 °C | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.6 mm | 7 mm | MICROCHIP TECHNOLOGY INC | compliant | 8541.29.00.95 | EAR99 | Microchip | 2016-03-02 | |||||||||||||
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HV2601BD-M936
Microchip Technology Inc
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$26.9750 | Yes | Yes | Active | 5 V | YES | 38 Ω | 1.9 Ω | 5 µs | 5 µs | SINGLE-ENDED MULTIPLEXER | CMOS | 30 V | -30 V | NO | 16 | 1 | 33 dB | 4 mA | 5.5 V | 3 V | COMMERCIAL | R-PBGA-B42 | Not Qualified | e1 | 70 °C | 42 | PLASTIC/EPOXY | TFBGA | BGA42,8X8,24 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 600 µm | BOTTOM | 5.3 mm | 1.02 mm | 5.29 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | ||||||||||||
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HV2601BDM936
Supertex Inc
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Check for Price | Yes | Transferred | 3.3 V | YES | 38 Ω | 5 Ω | 5 µs | 5 µs | SPST | CMOS | 1 | 1 | 33 dB | 5.5 V | 3 V | COMMERCIAL | R-PBGA-B42 | Not Qualified | e3 | 70 °C | 42 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | MATTE TIN | BALL | 600 µm | BOTTOM | 5.3 mm | 1.01 mm | 5.29 mm | SUPERTEX INC | BGA | TFBGA, | 42 | unknown | 8542.39.00.01 | |||||||||||||||
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HV2601GA-G
Supertex Inc
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Check for Price | Obsolete | 5 V | YES | 38 Ω | 5 Ω | 5 µs | 5 µs | SPST | CMOS | 1 | 1 | 33 dB | 5.5 V | 3 V | COMMERCIAL | R-PBGA-B48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 750 µm | BOTTOM | 8 mm | 1.16 mm | 7 mm | SUPERTEX INC | BGA | TFBGA, | 48 | unknown | 8542.39.00.01 | ||||||||||||||||||
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HV2601TQ-G
Microchip Technology Inc
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Check for Price | Yes | Active | 5 V | YES | 38 Ω | 1.3 Ω | 5 µs | 5 µs | SINGLE-ENDED MULTIPLEXER | CMOS | NO | 16 | 1 | 33 dB | SEPARATE OUTPUT | 4 mA | 5.5 V | 3 V | S-PQFP-G48 | e3 | 3 | 70 °C | 260 | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MICROCHIP TECHNOLOGY INC | TQFP-48 | compliant | Microchip | |||||||||||||
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HV2601BDM936
Microchip Technology Inc
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Check for Price | Active | 5 V | YES | 38 Ω | 1.9 Ω | 5 µs | 5 µs | SINGLE-ENDED MULTIPLEXER | CMOS | 30 V | -30 V | NO | 16 | 1 | 33 dB | 4 mA | 5.5 V | 3 V | COMMERCIAL | R-PBGA-B42 | Not Qualified | e1 | 70 °C | 42 | PLASTIC/EPOXY | TFBGA | BGA42,8X8,24 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 600 µm | BOTTOM | 5.3 mm | 1.02 mm | 5.29 mm | MICROCHIP TECHNOLOGY INC | TFBGA, | compliant | 8542.39.00.01 |