Parametric results for: HV2601 under Multiplexers or Switches

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Manufacturer Part Number: hv2601
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HV2601FG-G
Supertex Inc
$12.3495 Yes Yes Transferred 3.3 V YES 38 Ω 5 Ω 5 µs 5 µs SPST CMOS ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY 1 1 33 dB 5.5 V 3 V COMMERCIAL S-PQFP-G48 Not Qualified e3 3 70 °C 48 PLASTIC/EPOXY LFQFP QFP48,.35SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 7 mm 1.6 mm 7 mm SUPERTEX INC QFP LFQFP, QFP48,.35SQ,20 48 compliant 8542.39.00.01
HV2601FG-G
Microchip Technology Inc
$16.8595 Yes Active 5 V YES 38 Ω 1.9 Ω 5 µs 5 µs SINGLE-ENDED MULTIPLEXER CMOS ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY 30 V -30 V NO 16 1 33 dB 4 mA 5.5 V 3 V COMMERCIAL S-PQFP-G48 Not Qualified e3 70 °C 48 PLASTIC/EPOXY LFQFP QFP48,.35SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 7 mm 1.6 mm 7 mm MICROCHIP TECHNOLOGY INC compliant 8541.29.00.95 EAR99 Microchip
HV2601TQ-G-M931
Microchip Technology Inc
$17.5300 Yes Active 5 V YES 38 Ω 1.3 Ω 5 µs 5 µs SINGLE-ENDED MULTIPLEXER CMOS NO 16 1 33 dB SEPARATE OUTPUT 4 mA 5.5 V 3 V S-PQFP-G48 e3 3 70 °C 260 48 PLASTIC/EPOXY TFQFP TQFP48,.35SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH Matte Tin (Sn) - annealed GULL WING 500 µm QUAD 7 mm 1.2 mm 7 mm MICROCHIP TECHNOLOGY INC TQFP-48 compliant
HV2601FG-G-M931
Microchip Technology Inc
$19.8379 Yes Active 5 V YES 38 Ω 1.3 Ω 5 µs 5 µs SINGLE-ENDED MULTIPLEXER CMOS NO 16 1 33 dB SEPARATE OUTPUT 4 mA 5.5 V 3 V S-PQFP-G48 e3 70 °C 48 PLASTIC/EPOXY LFQFP QFP48,.35SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 7 mm 1.6 mm 7 mm MICROCHIP TECHNOLOGY INC compliant 8541.29.00.95 EAR99 Microchip 2016-03-02
HV2601BD-M936
Microchip Technology Inc
$26.9750 Yes Yes Active 5 V YES 38 Ω 1.9 Ω 5 µs 5 µs SINGLE-ENDED MULTIPLEXER CMOS 30 V -30 V NO 16 1 33 dB 4 mA 5.5 V 3 V COMMERCIAL R-PBGA-B42 Not Qualified e1 70 °C 42 PLASTIC/EPOXY TFBGA BGA42,8X8,24 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 600 µm BOTTOM 5.3 mm 1.02 mm 5.29 mm MICROCHIP TECHNOLOGY INC compliant Microchip
HV2601BDM936
Supertex Inc
Check for Price Yes Transferred 3.3 V YES 38 Ω 5 Ω 5 µs 5 µs SPST CMOS 1 1 33 dB 5.5 V 3 V COMMERCIAL R-PBGA-B42 Not Qualified e3 70 °C 42 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH MATTE TIN BALL 600 µm BOTTOM 5.3 mm 1.01 mm 5.29 mm SUPERTEX INC BGA TFBGA, 42 unknown 8542.39.00.01
HV2601GA-G
Supertex Inc
Check for Price Obsolete 5 V YES 38 Ω 5 Ω 5 µs 5 µs SPST CMOS 1 1 33 dB 5.5 V 3 V COMMERCIAL R-PBGA-B48 Not Qualified 70 °C 48 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH BALL 750 µm BOTTOM 8 mm 1.16 mm 7 mm SUPERTEX INC BGA TFBGA, 48 unknown 8542.39.00.01
HV2601TQ-G
Microchip Technology Inc
Check for Price Yes Active 5 V YES 38 Ω 1.3 Ω 5 µs 5 µs SINGLE-ENDED MULTIPLEXER CMOS NO 16 1 33 dB SEPARATE OUTPUT 4 mA 5.5 V 3 V S-PQFP-G48 e3 3 70 °C 260 48 PLASTIC/EPOXY TFQFP TQFP48,.35SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH Matte Tin (Sn) - annealed GULL WING 500 µm QUAD 7 mm 1.2 mm 7 mm MICROCHIP TECHNOLOGY INC TQFP-48 compliant Microchip
HV2601BDM936
Microchip Technology Inc
Check for Price Active 5 V YES 38 Ω 1.9 Ω 5 µs 5 µs SINGLE-ENDED MULTIPLEXER CMOS 30 V -30 V NO 16 1 33 dB 4 mA 5.5 V 3 V COMMERCIAL R-PBGA-B42 Not Qualified e1 70 °C 42 PLASTIC/EPOXY TFBGA BGA42,8X8,24 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 600 µm BOTTOM 5.3 mm 1.02 mm 5.29 mm MICROCHIP TECHNOLOGY INC TFBGA, compliant 8542.39.00.01