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HI1-5046-8
Harris Semiconductor
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Check for Price | No | Obsolete | NO | 75 Ω | 1 µs | DPDT | CMOS | 1 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B (Modified) | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | HARRIS SEMICONDUCTOR | DIP-16 | unknown | 8542.39.00.01 | ||||||||
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HI1-5046-8
Intersil Corporation
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Check for Price | No | Obsolete | NO | 75 Ω | 1 µs | DPDT | CMOS | 1 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B (Modified) | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INTERSIL CORP | DIP-16 | not_compliant | 8542.39.00.01 | ||||||||
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HI1-5046/883
Harris Semiconductor
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Check for Price | No | Obsolete | 15 V | NO | -15 V | 75 Ω | 2 Ω | 500 ns | 500 ns | DPDT | CMOS | 2 | 1 | 80 dB | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-GDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | 16 | CERAMIC, GLASS-SEALED | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | HARRIS SEMICONDUCTOR | DIP, DIP16,.3 | unknown | 8542.39.00.01 | |||
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HI1-5046/883
Thomson Consumer Electronics
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Check for Price | Obsolete | THOMSON CONSUMER ELECTRONICS | , | unknown | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||
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HI1-5046/883
Intersil Corporation
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Check for Price | No | Obsolete | 15 V | NO | -15 V | 150 Ω | 2 Ω | 500 ns | 500 ns | DPDT | CMOS | 2 | 1 | 80 dB | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INTERSIL CORP | DIP, DIP16,.3 | not_compliant | 8542.39.00.01 |