Findchips: Parametric Search Results for HD74ALVC2G34US-E


Select Parts		Part Number

		HD74ALVC2G34US-E Renesas Electronics Corporation
		HD74ALVC2G34US-E Hitachi Ltd
		HD74ALVC2G34USE-E Renesas Electronics Corporation
		HD74ALVC2G34USE Renesas Electronics Corporation

				Most Relevant										Technical						Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Prop. Delay@Nom-Sup	Number of Functions	Number of Inputs	Surface Mount	Package Code	Load Capacitance (CL)	Schmitt Trigger	Family	Logic IC Type	Technology	Max I(ol)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

Yes

Active

1.5 V

7 ns

YES

VSSOP

ALVC/VCX/A

BUFFER

CMOS

3.6 V

1.2 V

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TIN BISMUTH

GULL WING

500 µm

DUAL

900 µm

2 mm

2.3 mm

RENESAS ELECTRONICS CORP

SOIC

SSOP-8

compliant

Check for Price

Yes

Transferred

1.5 V

7 ns

2.5 ns

YES

VSSOP

30 pF

ALVC/VCX/A

BUFFER

CMOS

24 mA

3.6 V

1.2 V

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP8,.12,20

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

GULL WING

500 µm

DUAL

900 µm

2 mm

2.3 mm

HITACHI LTD

SOIC

VSSOP, TSSOP8,.12,20

unknown

8542.39.00.01

Check for Price

Yes

Not Recommended

1.5 V

7 ns

YES

VSSOP

ALVC/VCX/A

BUFFER

CMOS

3.6 V

1.2 V

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

GULL WING

500 µm

DUAL

900 µm

2 mm

2.3 mm

RENESAS ELECTRONICS CORP

SOIC

VSSOP,

compliant

8542.39.00.01

Check for Price

Active

1.5 V

7 ns

2.5 ns

YES

VSSOP

30 pF

ALVC/VCX/A

BUFFER

CMOS

24 mA

3.6 V

1.2 V

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP8,.12,20

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TIN LEAD

GULL WING

500 µm

DUAL

900 µm

2 mm

2.3 mm

RENESAS ELECTRONICS CORP

SOIC

VSSOP, TSSOP8,.12,20

compliant

8542.39.00.01

Compare

HD74ALVC2G34US-E

Renesas Electronics Corporation

Check for Price

Yes

Active

1.5 V

7 ns

YES

VSSOP

ALVC/VCX/A

BUFFER

CMOS

3.6 V

1.2 V

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TIN BISMUTH

GULL WING

500 µm

DUAL

900 µm

2 mm

2.3 mm

RENESAS ELECTRONICS CORP

SOIC

SSOP-8

compliant

HD74ALVC2G34US-E

Hitachi Ltd

Check for Price

Yes

Transferred

1.5 V

7 ns

2.5 ns

YES

VSSOP

30 pF

ALVC/VCX/A

BUFFER

CMOS

24 mA

3.6 V

1.2 V

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP8,.12,20

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

GULL WING

500 µm

DUAL

900 µm

2 mm

2.3 mm

HITACHI LTD

SOIC

VSSOP, TSSOP8,.12,20

unknown

8542.39.00.01

HD74ALVC2G34USE-E

Renesas Electronics Corporation

Check for Price

Yes

Not Recommended

1.5 V

7 ns

YES

VSSOP

ALVC/VCX/A

BUFFER

CMOS

3.6 V

1.2 V

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

GULL WING

500 µm

DUAL

900 µm

2 mm

2.3 mm

RENESAS ELECTRONICS CORP

SOIC

VSSOP,

compliant

8542.39.00.01

HD74ALVC2G34USE

Renesas Electronics Corporation

Check for Price

Active

1.5 V

7 ns

2.5 ns

YES

VSSOP

30 pF

ALVC/VCX/A

BUFFER

CMOS

24 mA

3.6 V

1.2 V

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP8,.12,20

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TIN LEAD

GULL WING

500 µm

DUAL

900 µm

2 mm

2.3 mm

RENESAS ELECTRONICS CORP

SOIC

VSSOP, TSSOP8,.12,20

compliant

8542.39.00.01

Parametric results for: HD74ALVC2G34US-E under Gates