Findchips: Parametric Search Results for HCS273MS

Parametric results for: HCS273MS under FF/Latches

Select parts from the table below to compare.

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Select Parts		Part Number

		PSN74HCS273PWR Texas Instruments
		PSN74HCS273QPWRQ1 Texas Instruments
		HCS273DMSR Intersil Corporation
		HCS273DMSH Harris Semiconductor
		HCS273K/SAMPLE Intersil Corporation
		HCS273KMSR Intersil Corporation
		5962R9579101VRX Intersil Corporation
		HCS273-01GG Advanced Interconnections Corp
		5962R9579101VRC Harris Semiconductor
		HCS273-04TT Advanced Interconnections Corp

			Most Relevant												Technical										Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Prop. Delay@Nom-Sup	Number of Functions	Number of Bits	Surface Mount	Package Code	Max Frequency@Nom-Sup	Load Capacitance (CL)	Schmitt Trigger	Trigger Type	Family	Logic IC Type	Technology	Additional Feature	fmax-Min	Max I(ol)	Output Polarity	Power Supply Current-Max (ICC)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Total Dose	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code	ECCN Code	Body Breadth	Body Depth	Body Length	Contact Configuration	Contact Finish Mating	Contact Finish Termination	Contact Material	Contact Style	Device Socket Type	Device Type Used On	Housing Material	Mating Contact Pitch	Mounting Style	Number of Contacts	PCB Contact Pattern	PCB Contact Row Spacing	Termination Type

$0.1189

Active

4.5 V

34.6 ns

16.4 ns

YES

TSSOP

135 MHz

50 pF

YES

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

135 MHz

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G20

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP20,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

6.5 mm

$0.1308

Active

4.5 V

34.6 ns

16.4 ns

YES

TSSOP

135 MHz

50 pF

YES

POSITIVE EDGE

D FLIP-FLOP

CMOS

135 MHz

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G20

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

TSSOP20,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

6.5 mm

Check for Price

Obsolete

5 V

27 ns

DIP

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

6 mA

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T20

Not Qualified

125 °C

-55 °C

MIL-PRF-38535 Class V

200k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

DIP20,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

7.62 mm

INTERSIL CORP

DIP

DIP, DIP20,.3

not_compliant

8542.39.00.01

Check for Price

Obsolete

5 V

34 ns

DIP

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY

5 mA

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T20

Not Qualified

125 °C

-55 °C

38535V;38534K;883S

1M Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

DIP20,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

HARRIS SEMICONDUCTOR

DIP, DIP20,.3

unknown

8542.39.00.01

Check for Price

Obsolete

5 V

23 ns

YES

DFP

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

R-CDFP-F20

Not Qualified

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

FLATPACK

FLAT

1.27 mm

DUAL

2.92 mm

6.92 mm

INTERSIL CORP

DFP

DFP,

unknown

8542.39.00.01

Check for Price

Obsolete

5 V

27 ns

YES

DFP

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

6 mA

TRUE

5.5 V

4.5 V

MILITARY

R-CDFP-F20

Not Qualified

125 °C

-55 °C

MIL-PRF-38535 Class V

200k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

FL20,.3

RECTANGULAR

FLATPACK

TIN LEAD

FLAT

1.27 mm

DUAL

2.92 mm

6.92 mm

INTERSIL CORP

DFP

DFP, FL20,.3

not_compliant

8542.39.00.01

Check for Price

Obsolete

5 V

27 ns

DIP

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T20

Not Qualified

125 °C

-55 °C

100k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

7.62 mm

INTERSIL CORP

DIP

DIP,

unknown

8542.39.00.01

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

2.1 inch

0.165 inch

2.1 inch

21X21

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA273

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

273

RECTANGULAR

100 µm

SOLDER

Check for Price

Transferred

5 V

27 ns

DIP

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T20

Not Qualified

125 °C

-55 °C

100k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

GOLD

THROUGH-HOLE

DUAL

HARRIS SEMICONDUCTOR

unknown

8542.39.00.01

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

2.1 inch

0.12 inch

2.1 inch

21X21

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA273

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

273

RECTANGULAR

100 µm

SOLDER

1 2 3 4 5 Next

Compare

PSN74HCS273PWR

Texas Instruments

$0.1189

Active

4.5 V

34.6 ns

16.4 ns

YES

TSSOP

135 MHz

50 pF

YES

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

135 MHz

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G20

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP20,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

6.5 mm

PSN74HCS273QPWRQ1

Texas Instruments

$0.1308

Active

4.5 V

34.6 ns

16.4 ns

YES

TSSOP

135 MHz

50 pF

YES

POSITIVE EDGE

D FLIP-FLOP

CMOS

135 MHz

7.8 mA

TRUE

2 µA

6 V

2 V

AUTOMOTIVE

R-PDSO-G20

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

TSSOP20,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

6.5 mm

HCS273DMSR

Intersil Corporation

Check for Price

Obsolete

5 V

27 ns

DIP

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

6 mA

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T20

Not Qualified

125 °C

-55 °C

MIL-PRF-38535 Class V

200k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

DIP20,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

7.62 mm

INTERSIL CORP

DIP

DIP, DIP20,.3

not_compliant

8542.39.00.01

HCS273DMSH

Harris Semiconductor

Check for Price

Obsolete

5 V

34 ns

DIP

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY

5 mA

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T20

Not Qualified

125 °C

-55 °C

38535V;38534K;883S

1M Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

DIP20,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

HARRIS SEMICONDUCTOR

DIP, DIP20,.3

unknown

8542.39.00.01

HCS273K/SAMPLE

Intersil Corporation

Check for Price

Obsolete

5 V

23 ns

YES

DFP

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

R-CDFP-F20

Not Qualified

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

FLATPACK

FLAT

1.27 mm

DUAL

2.92 mm

6.92 mm

INTERSIL CORP

DFP

DFP,

unknown

8542.39.00.01

HCS273KMSR

Intersil Corporation

Check for Price

Obsolete

5 V

27 ns

YES

DFP

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

6 mA

TRUE

5.5 V

4.5 V

MILITARY

R-CDFP-F20

Not Qualified

125 °C

-55 °C

MIL-PRF-38535 Class V

200k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

FL20,.3

RECTANGULAR

FLATPACK

TIN LEAD

FLAT

1.27 mm

DUAL

2.92 mm

6.92 mm

INTERSIL CORP

DFP

DFP, FL20,.3

not_compliant

8542.39.00.01

5962R9579101VRX

Intersil Corporation

Check for Price

Obsolete

5 V

27 ns

DIP

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T20

Not Qualified

125 °C

-55 °C

100k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

7.62 mm

INTERSIL CORP

DIP

DIP,

unknown

8542.39.00.01

HCS273-01GG

Advanced Interconnections Corp

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

2.1 inch

0.165 inch

2.1 inch

21X21

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA273

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

273

RECTANGULAR

100 µm

SOLDER

5962R9579101VRC

Harris Semiconductor

Check for Price

Transferred

5 V

27 ns

DIP

50 pF

POSITIVE EDGE

HC/UH

D FLIP-FLOP

CMOS

TRUE

5.5 V

4.5 V

MILITARY

R-CDIP-T20

Not Qualified

125 °C

-55 °C

100k Rad(Si) V

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

GOLD

THROUGH-HOLE

DUAL

HARRIS SEMICONDUCTOR

unknown

8542.39.00.01

HCS273-04TT

Advanced Interconnections Corp

Check for Price

Obsolete

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

2.54 mm

ADVANCED INTERCONNECTIONS CORP

compliant

8536.69.40.40

EAR99

2.1 inch

0.12 inch

2.1 inch

21X21

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

BE-CU

RND PIN-SKT

IC SOCKET

PGA273

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

273

RECTANGULAR

100 µm

SOLDER

1 2 3 4 5 Next